JPH0510363Y2 - - Google Patents
Info
- Publication number
- JPH0510363Y2 JPH0510363Y2 JP1987011304U JP1130487U JPH0510363Y2 JP H0510363 Y2 JPH0510363 Y2 JP H0510363Y2 JP 1987011304 U JP1987011304 U JP 1987011304U JP 1130487 U JP1130487 U JP 1130487U JP H0510363 Y2 JPH0510363 Y2 JP H0510363Y2
- Authority
- JP
- Japan
- Prior art keywords
- capillary
- identification display
- rear end
- end surface
- wire bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987011304U JPH0510363Y2 (cs) | 1987-01-28 | 1987-01-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987011304U JPH0510363Y2 (cs) | 1987-01-28 | 1987-01-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63119239U JPS63119239U (cs) | 1988-08-02 |
| JPH0510363Y2 true JPH0510363Y2 (cs) | 1993-03-15 |
Family
ID=30798396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987011304U Expired - Lifetime JPH0510363Y2 (cs) | 1987-01-28 | 1987-01-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0510363Y2 (cs) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2737642B2 (ja) * | 1994-02-16 | 1998-04-08 | 日本電気株式会社 | ワイヤボンディング装置 |
| DE102007051550A1 (de) * | 2007-10-29 | 2009-04-30 | Robert Bosch Gmbh | Stößel für ein Magnetventil und ein Verfahren zur Kennzeichnung von Stößeln für Magnetventile |
-
1987
- 1987-01-28 JP JP1987011304U patent/JPH0510363Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63119239U (cs) | 1988-08-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3865872B2 (ja) | 真空吸着保持装置 | |
| JPH0510363Y2 (cs) | ||
| US4853671A (en) | Electric laminar resistor and method of making same | |
| JPH056656Y2 (cs) | ||
| JPH05218283A (ja) | 半導体装置 | |
| US4388167A (en) | Ion selective electrode | |
| JPS639950A (ja) | 半導体素子の分離方法 | |
| JPH06181276A (ja) | 半導体装置用リード | |
| JPH0437020A (ja) | 熱圧着ウエーハの製造方法 | |
| JPH10321651A (ja) | 半導体装置 | |
| JPS5834770B2 (ja) | 熱電対の製造方法 | |
| JPS6023997Y2 (ja) | 加熱用圧着子 | |
| JP2536110B2 (ja) | ボンディングパッドの形成方法 | |
| JP2702182B2 (ja) | 半導体装置およびその製造方法 | |
| JPH0337859B2 (cs) | ||
| JPH07329329A (ja) | 熱印字用基板 | |
| JPH06291213A (ja) | 半導体パッケージ及びその製造方法 | |
| JPH0451506Y2 (cs) | ||
| JPH01204762A (ja) | サーマルヘッド | |
| JP2550488Y2 (ja) | プラグイン型半導体素子収納用パッケージ | |
| JPH0316779B2 (cs) | ||
| JPH0750355A (ja) | 半導体パッケージ用のセラミック製リッド基板 | |
| JPS5892576A (ja) | サ−マルヘツドの製造方法 | |
| JPS58177947U (ja) | 半導体装置 | |
| JPS61226990A (ja) | 電気回路用基体 |