JPH0499344A - Structure of flexible substrate for tab - Google Patents
Structure of flexible substrate for tabInfo
- Publication number
- JPH0499344A JPH0499344A JP21771190A JP21771190A JPH0499344A JP H0499344 A JPH0499344 A JP H0499344A JP 21771190 A JP21771190 A JP 21771190A JP 21771190 A JP21771190 A JP 21771190A JP H0499344 A JPH0499344 A JP H0499344A
- Authority
- JP
- Japan
- Prior art keywords
- outer lead
- flexible substrate
- cut
- flexible
- tab
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title abstract description 14
- 238000000034 method Methods 0.000 abstract description 4
- 230000008602 contraction Effects 0.000 abstract description 3
- 238000004806 packaging method and process Methods 0.000 abstract 2
- 230000000694 effects Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はＴＡＢ用フレキシブル基板の構造に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to the structure of a flexible substrate for TAB.
従来のＴＡＢ用フレキシブル基板は第３図の如き構造で
あった。即ち第３図においてフレキシブル基板上６にあ
らかじめ銅などにより形成されたアウターリード２と回
路基板１をはんだ付は及びＬＣＤパネルの電極を異方性
導電膜などを介して接続するなどによりアウターリード
ボンディングと呼ばれる半導体装置の実装方法が行なわ
れていた。A conventional TAB flexible substrate had a structure as shown in FIG. That is, in FIG. 3, outer lead bonding is performed by soldering the outer leads 2 previously formed on the flexible substrate 6 of copper or the like and the circuit board 1, and connecting the electrodes of the LCD panel via an anisotropic conductive film. A method of mounting semiconductor devices called .
前述の従来技術では、実装したＴＡＥ用フレキシブル基
板に於いて外部よりの衝撃及び応力によリアウターリー
ド部が切れたり、亀裂が入るといった問題点を有する。The above-mentioned conventional technology has a problem in that the rear outer lead portion of the mounted TAE flexible substrate may be cut or cracked due to external impact and stress.
すなわち第４図（α）に示すこと（、アウターリード２
はフレキシブル基板６により保持され、回路基板１及び
、ＬＣＤパネルを吊る状態になっている。このとき厚さ
４０μｍ程度の銅でできたアウターリードは、厚さ１０
０μｍ程度のポリイミドなどの樹脂でできたフレキシブ
ル基板よりも軟らかいため図中矢印の部分に力が集中す
る。That is, what is shown in FIG. 4 (α) (outer lead 2
is held by a flexible board 6, and the circuit board 1 and LCD panel are suspended. At this time, the outer lead made of copper with a thickness of about 40 μm has a thickness of 10 μm.
Since it is softer than a flexible substrate made of resin such as polyimide with a thickness of about 0 μm, the force is concentrated in the area indicated by the arrow in the figure.
さらに温度変化による伸び縮みや取扱い上の引張りやネ
ジリが作用する部分に応力が集中し、亀裂や切断を生ず
る（第４図ｂ）
そこで本発明はこの様な問題を解決するものでその目的
はアウターリードの切れ、亀裂を防止するＴＡＢフレキ
シブル基板を提供するところにある。Furthermore, stress is concentrated in areas where expansion and contraction due to temperature changes and tension and twisting during handling act, resulting in cracks and breaks (Figure 4b).The present invention is intended to solve these problems, and its purpose is to The purpose of the present invention is to provide a TAB flexible substrate that prevents outer leads from breaking and cracking.
本発明のＴＡＢ用フレキシブル基板の構造は、フレキシ
ブルテープの回路基板及びＬＣＤパネル側の各アウター
リードの間に切り欠きを設けた事を特徴とする。The structure of the flexible board for TAB of the present invention is characterized in that a notch is provided between each outer lead on the circuit board and LCD panel side of the flexible tape.
第１図は本発明の実施例を示す平面図であって図中１な
いし６は従来の例と同様のものを示す。FIG. 1 is a plan view showing an embodiment of the present invention, and numerals 1 to 6 in the figure show the same parts as the conventional example.
フレキシブルテープ６の回路基板及びＬＣＤパネル側の
各アウターリード２０間に切り欠き４が設けである。A notch 4 is provided between each outer lead 20 of the flexible tape 6 on the circuit board and LCD panel side.
第２図に本発明の断面図を示す。フレキシブル基板５に
切り欠き４を設けたのでフレキシブル基板のこわさがア
ウターリード方向に対して連続的に変化するためアウタ
ーリードの一部分に力が集中する事が無（なった。これ
により温度変化による伸び縮みや引っ張り、ネジレなど
の外力に対してアウターリードの切れにくい回路実装及
びパネル実装の方法を実現できた。このように本発明の
実用的効果は極めて大きい。FIG. 2 shows a sectional view of the present invention. Since the notch 4 is provided in the flexible substrate 5, the stiffness of the flexible substrate changes continuously in the direction of the outer leads, so there is no concentration of force on a part of the outer leads.This prevents elongation due to temperature changes. It has been possible to realize a circuit mounting and panel mounting method in which the outer lead is not easily cut by external forces such as shrinkage, tension, twisting, etc. As described above, the practical effects of the present invention are extremely large.
〔発明の効果〕
本発明によりフレキノプル基板のこわさがアウターリー
ド方向に対して連続的に変化するためアウターリードの
一部分に力が集中する事が無くなった。これにより温度
変化による伸び縮みや引っ張り、ネジレなどの外力に対
してアウターリードの切れにくい回路実装及びパネル実
装の方法を実現でき、実用上極めて大なる効果を有する
ものである。[Effects of the Invention] According to the present invention, the stiffness of the flexinople substrate changes continuously in the direction of the outer leads, so that force is no longer concentrated on a portion of the outer leads. As a result, it is possible to realize a circuit mounting and panel mounting method in which the outer lead is difficult to break due to external forces such as expansion/contraction, tension, and twisting caused by temperature changes, and has an extremely large practical effect.
第１図は本発明の実施例を示す一部平面図。
第２図は本発明の実施例を示す一部断面図。
第５図は従来例を示す平面図。
第４図は従来例を示す断面図。
１・・・・・・・・・回路基板
２・・・・・・・・・アウターリード
５・・・・・・・・・フレキシブルテープ４・・・・・
・・・・切り欠き
以上FIG. 1 is a partial plan view showing an embodiment of the present invention. FIG. 2 is a partially sectional view showing an embodiment of the present invention. FIG. 5 is a plan view showing a conventional example. FIG. 4 is a sectional view showing a conventional example. 1......Circuit board 2...Outer lead 5...Flexible tape 4...
・・・More than notch
Claims (1)
基板の各アウターリードの間に切り欠きを設けた事を特
徴とするＴＡＢ用フレキシブル基板の構造。A structure of a flexible board for TAB, characterized in that a notch is provided between each outer lead of the flexible board in the flexible board for TAB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21771190A JPH0499344A (en) | 1990-08-18 | 1990-08-18 | Structure of flexible substrate for tab |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21771190A JPH0499344A (en) | 1990-08-18 | 1990-08-18 | Structure of flexible substrate for tab |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0499344A true JPH0499344A (en) | 1992-03-31 |
Family
ID=16708542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21771190A Pending JPH0499344A (en) | 1990-08-18 | 1990-08-18 | Structure of flexible substrate for tab |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0499344A (en) |
-
1990
- 1990-08-18 JP JP21771190A patent/JPH0499344A/en active Pending
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