JPH0485762U - - Google Patents

Info

Publication number
JPH0485762U
JPH0485762U JP12869490U JP12869490U JPH0485762U JP H0485762 U JPH0485762 U JP H0485762U JP 12869490 U JP12869490 U JP 12869490U JP 12869490 U JP12869490 U JP 12869490U JP H0485762 U JPH0485762 U JP H0485762U
Authority
JP
Japan
Prior art keywords
circuit board
conductor
polyacetylene
regularity
iodine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12869490U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12869490U priority Critical patent/JPH0485762U/ja
Publication of JPH0485762U publication Critical patent/JPH0485762U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Non-Insulated Conductors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例に係る回路基板を示す
断面図、第２図は実施例に係る回路基板に表面実
装部品を実装した状態を示す断面図、第３図は実
施例に係る回路基板へ電気部品を実装する製造工
程の一例を示すフローチヤート、第４図は従来の
回路基板へ電気部品を実装する製造工程の一例を
示すフローチヤートである。 １……パターン印刷、２……積層界面、３……
スルホール、４……接続材、５……ガラスエポキ
シ基材、６……エポキシ樹脂、７……接着剤、８
……共用器、９……リード電極、１０……フラツ
トＩＣ、１１……チツプ部品。

Claims (1)

    【実用新案登録請求の範囲】
  1. 絶縁体および導電体とから構成された回路基板
    において、前記の導電体を共役系結合で構成され
    るポリアセチレン等の高分子によう素、５ふつ化
    ひ素等の電子受容体を添加し、さらに錯体の配列
    構造の規則性を高めて得られた電気伝導性化合物
    で構成したことを特徴とする回路基板。
JP12869490U 1990-11-30 1990-11-30 Pending JPH0485762U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12869490U JPH0485762U (ja) 1990-11-30 1990-11-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12869490U JPH0485762U (ja) 1990-11-30 1990-11-30

Publications (1)

Publication Number Publication Date
JPH0485762U true JPH0485762U (ja) 1992-07-24

Family

ID=31876140

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12869490U Pending JPH0485762U (ja) 1990-11-30 1990-11-30

Country Status (1)

Country Link
JP (1) JPH0485762U (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5688205A (en) * 1979-12-20 1981-07-17 Ibm Method of manufacturing electric circuit
JPS60165786A (ja) * 1984-02-09 1985-08-28 株式会社東芝 導電パタ−ンの形成方法
JPS61234090A (ja) * 1985-04-10 1986-10-18 松下電器産業株式会社 パタ−ン形成方法
JPH03218691A (ja) * 1990-01-24 1991-09-26 Fujitsu Ltd 導電性高分子材料の形成方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5688205A (en) * 1979-12-20 1981-07-17 Ibm Method of manufacturing electric circuit
JPS60165786A (ja) * 1984-02-09 1985-08-28 株式会社東芝 導電パタ−ンの形成方法
JPS61234090A (ja) * 1985-04-10 1986-10-18 松下電器産業株式会社 パタ−ン形成方法
JPH03218691A (ja) * 1990-01-24 1991-09-26 Fujitsu Ltd 導電性高分子材料の形成方法

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