JPH01140899U - - Google Patents
Info
- Publication number
- JPH01140899U JPH01140899U JP1988036474U JP3647488U JPH01140899U JP H01140899 U JPH01140899 U JP H01140899U JP 1988036474 U JP1988036474 U JP 1988036474U JP 3647488 U JP3647488 U JP 3647488U JP H01140899 U JPH01140899 U JP H01140899U
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- conductive resin
- potential
- integrated circuit
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図および第２図はそれぞれ本考案の一実施
例および他の実施例の断面図、第３図は従来の混
成集積回路装置の断面図である。 １，１ａ，１ｂ……絶縁基板、２……導体パタ
ーン、３……能動素子、４……プリコート、５…
…受動素子、６……外部端子、７……導電性樹脂
、８……金属板、９……封止樹脂。
例および他の実施例の断面図、第３図は従来の混
成集積回路装置の断面図である。 １，１ａ，１ｂ……絶縁基板、２……導体パタ
ーン、３……能動素子、４……プリコート、５…
…受動素子、６……外部端子、７……導電性樹脂
、８……金属板、９……封止樹脂。
Claims (1)
- 能動素子および／または受動素子を搭載した２
枚の回路基板を導電性樹脂あるいは金属板を介し
て貼り合せ、前記導電性樹脂あるいは金属板を不
動の最低電位あるいは最高電位等の基準電位点に
電気的に接続していることを特徴とする混成集積
回路装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988036474U JPH01140899U (ja) | 1988-03-18 | 1988-03-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988036474U JPH01140899U (ja) | 1988-03-18 | 1988-03-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01140899U true JPH01140899U (ja) | 1989-09-27 |
Family
ID=31263076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988036474U Pending JPH01140899U (ja) | 1988-03-18 | 1988-03-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01140899U (ja) |
-
1988
- 1988-03-18 JP JP1988036474U patent/JPH01140899U/ja active Pending