JPH048511B2 - - Google Patents
Info
- Publication number
- JPH048511B2 JPH048511B2 JP60501924A JP50192485A JPH048511B2 JP H048511 B2 JPH048511 B2 JP H048511B2 JP 60501924 A JP60501924 A JP 60501924A JP 50192485 A JP50192485 A JP 50192485A JP H048511 B2 JPH048511 B2 JP H048511B2
- Authority
- JP
- Japan
- Prior art keywords
- silicon
- oxygen
- sih
- sample
- silicon oxynitride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
-
- H10P14/6927—
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/308—Oxynitrides
-
- H10P14/6338—
-
- H10P14/6682—
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
- Plasma & Fusion (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/627,366 US4543271A (en) | 1984-07-02 | 1984-07-02 | Silicon oxynitride material and photochemical process for forming same |
| US627366 | 1984-07-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61502616A JPS61502616A (ja) | 1986-11-13 |
| JPH048511B2 true JPH048511B2 (cg-RX-API-DMAC10.html) | 1992-02-17 |
Family
ID=24514356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60501924A Granted JPS61502616A (ja) | 1984-07-02 | 1985-04-22 | 改良されたシリコンオキシニトリド材料及びその製造方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US4543271A (cg-RX-API-DMAC10.html) |
| EP (1) | EP0188438B1 (cg-RX-API-DMAC10.html) |
| JP (1) | JPS61502616A (cg-RX-API-DMAC10.html) |
| KR (1) | KR890003018B1 (cg-RX-API-DMAC10.html) |
| DE (1) | DE3578438D1 (cg-RX-API-DMAC10.html) |
| HK (1) | HK93390A (cg-RX-API-DMAC10.html) |
| IL (1) | IL75278A0 (cg-RX-API-DMAC10.html) |
| WO (1) | WO1986000651A1 (cg-RX-API-DMAC10.html) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4702936A (en) * | 1984-09-20 | 1987-10-27 | Applied Materials Japan, Inc. | Gas-phase growth process |
| US4654226A (en) * | 1986-03-03 | 1987-03-31 | The University Of Delaware | Apparatus and method for photochemical vapor deposition |
| DE3902628A1 (de) * | 1989-01-30 | 1990-08-02 | Hauni Elektronik Gmbh | Duennschichtmaterial fuer sensoren oder aktuatoren und verfahren zu dessen herstellung |
| FR2651782B1 (fr) * | 1989-09-14 | 1993-03-19 | Air Liquide | Procede pour la realisation d'un depot d'un revetement protecteur inorganique et amorphe sur un substrat polymerique organique. |
| FR2695118B1 (fr) * | 1992-09-02 | 1994-10-07 | Air Liquide | Procédé de formation d'une couche barrière sur une surface d'un objet en verre. |
| EP0627763B1 (en) * | 1993-05-31 | 2004-12-15 | STMicroelectronics S.r.l. | Process for improving the adhesion between dielectric layers at their interface in semiconductor devices manufacture |
| US6284584B1 (en) | 1993-12-17 | 2001-09-04 | Stmicroelectronics, Inc. | Method of masking for periphery salicidation of active regions |
| US6107194A (en) * | 1993-12-17 | 2000-08-22 | Stmicroelectronics, Inc. | Method of fabricating an integrated circuit |
| US5439846A (en) * | 1993-12-17 | 1995-08-08 | Sgs-Thomson Microelectronics, Inc. | Self-aligned method for forming contact with zero offset to gate |
| US5728224A (en) * | 1995-09-13 | 1998-03-17 | Tetra Laval Holdings & Finance S.A. | Apparatus and method for manufacturing a packaging material using gaseous phase atmospheric photo chemical vapor deposition to apply a barrier layer to a moving web substrate |
| US7115461B2 (en) * | 1997-07-24 | 2006-10-03 | Texas Instruments Incorporated | High permittivity silicate gate dielectric |
| US6841439B1 (en) * | 1997-07-24 | 2005-01-11 | Texas Instruments Incorporated | High permittivity silicate gate dielectric |
| US6316820B1 (en) | 1997-07-25 | 2001-11-13 | Hughes Electronics Corporation | Passivation layer and process for semiconductor devices |
| US6046101A (en) * | 1997-12-31 | 2000-04-04 | Intel Corporation | Passivation technology combining improved adhesion in passivation and a scribe street without passivation |
| US6352940B1 (en) * | 1998-06-26 | 2002-03-05 | Intel Corporation | Semiconductor passivation deposition process for interfacial adhesion |
| US20010052323A1 (en) * | 1999-02-17 | 2001-12-20 | Ellie Yieh | Method and apparatus for forming material layers from atomic gasses |
| US20050227239A1 (en) * | 2004-04-08 | 2005-10-13 | Joyce Timothy H | Microarray based affinity purification and analysis device coupled with solid state nanopore electrodes |
| DE202007001431U1 (de) * | 2007-01-31 | 2007-05-16 | Infineon Technologies Austria Ag | Halbleiteranordnung und Leistungshalbleiterbauelement |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5148750B2 (cg-RX-API-DMAC10.html) * | 1971-08-26 | 1976-12-22 | ||
| IT1088852B (it) * | 1976-11-01 | 1985-06-10 | Rca Corp | Struttura passivante per un dispositivo simeconduttore |
| US4181751A (en) * | 1978-05-24 | 1980-01-01 | Hughes Aircraft Company | Process for the preparation of low temperature silicon nitride films by photochemical vapor deposition |
| JPS5559729A (en) * | 1978-10-27 | 1980-05-06 | Fujitsu Ltd | Forming method of semiconductor surface insulating film |
| US4289797A (en) * | 1979-10-11 | 1981-09-15 | Western Electric Co., Incorporated | Method of depositing uniform films of Six Ny or Six Oy in a plasma reactor |
| US4371587A (en) * | 1979-12-17 | 1983-02-01 | Hughes Aircraft Company | Low temperature process for depositing oxide layers by photochemical vapor deposition |
| JPS5693344A (en) * | 1979-12-26 | 1981-07-28 | Fujitsu Ltd | Manufacture of semiconductor device |
-
1984
- 1984-07-02 US US06/627,366 patent/US4543271A/en not_active Expired - Fee Related
-
1985
- 1985-04-22 KR KR1019860700127A patent/KR890003018B1/ko not_active Expired
- 1985-04-22 JP JP60501924A patent/JPS61502616A/ja active Granted
- 1985-04-22 WO PCT/US1985/000728 patent/WO1986000651A1/en not_active Ceased
- 1985-04-22 EP EP85902334A patent/EP0188438B1/en not_active Expired - Lifetime
- 1985-04-22 DE DE8585902334T patent/DE3578438D1/de not_active Expired - Fee Related
- 1985-05-22 IL IL75278A patent/IL75278A0/xx unknown
-
1990
- 1990-11-08 HK HK933/90A patent/HK93390A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US4543271A (en) | 1985-09-24 |
| KR860700269A (ko) | 1986-08-01 |
| DE3578438D1 (de) | 1990-08-02 |
| EP0188438A1 (en) | 1986-07-30 |
| KR890003018B1 (ko) | 1989-08-18 |
| JPS61502616A (ja) | 1986-11-13 |
| WO1986000651A1 (en) | 1986-01-30 |
| IL75278A0 (en) | 1985-09-29 |
| HK93390A (en) | 1990-11-16 |
| EP0188438B1 (en) | 1990-06-27 |
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