JPH0482198B2 - - Google Patents
Info
- Publication number
- JPH0482198B2 JPH0482198B2 JP61259238A JP25923886A JPH0482198B2 JP H0482198 B2 JPH0482198 B2 JP H0482198B2 JP 61259238 A JP61259238 A JP 61259238A JP 25923886 A JP25923886 A JP 25923886A JP H0482198 B2 JPH0482198 B2 JP H0482198B2
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- resin
- clad laminate
- copper
- shield layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 7
- 230000005520 electrodynamics Effects 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 37
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 239000011889 copper foil Substances 0.000 description 11
- 238000005530 etching Methods 0.000 description 6
- 239000004744 fabric Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25923886A JPS63111698A (ja) | 1986-10-30 | 1986-10-30 | 金属箔張積層板の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25923886A JPS63111698A (ja) | 1986-10-30 | 1986-10-30 | 金属箔張積層板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63111698A JPS63111698A (ja) | 1988-05-16 |
| JPH0482198B2 true JPH0482198B2 (enrdf_load_stackoverflow) | 1992-12-25 |
Family
ID=17331324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25923886A Granted JPS63111698A (ja) | 1986-10-30 | 1986-10-30 | 金属箔張積層板の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63111698A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7515099B2 (ja) * | 2020-03-23 | 2024-07-12 | パナソニックＩｐマネジメント株式会社 | 積層板の製造方法、及びプリント配線板の製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50118254A (enrdf_load_stackoverflow) * | 1974-03-04 | 1975-09-16 | ||
| JPS5374058U (enrdf_load_stackoverflow) * | 1976-11-24 | 1978-06-21 | ||
| JPS56144957A (en) * | 1980-04-15 | 1981-11-11 | Matsushita Electric Works Ltd | Manufacture of laminated board for multilayer printed wiring |
| JPS57145397A (en) * | 1981-03-04 | 1982-09-08 | Hitachi Ltd | Method of producing multilayer printed circuit board |
| JPS596861U (ja) * | 1982-07-07 | 1984-01-17 | 松下電器産業株式会社 | 配線基板 |
| JPS5948997A (ja) * | 1982-09-14 | 1984-03-21 | 松下電工株式会社 | 多層板の製法 |
| JPS59112992U (ja) * | 1983-01-19 | 1984-07-30 | パイオニア株式会社 | プリント基板 |
| JPS612393A (ja) * | 1984-06-15 | 1986-01-08 | 株式会社東芝 | 電子回路のシ−ルド方法 |
-
1986
- 1986-10-30 JP JP25923886A patent/JPS63111698A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63111698A (ja) | 1988-05-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0482198B2 (enrdf_load_stackoverflow) | ||
| JPH01163059A (ja) | 金属箔張り積層板 | |
| JP2501331B2 (ja) | 積層板 | |
| JPS63111699A (ja) | 金属箔張積層板の製造法 | |
| JPH02277297A (ja) | プリント配線板の製造方法 | |
| JPH02277294A (ja) | プリント配線板の製造方法 | |
| JPH0584214B2 (enrdf_load_stackoverflow) | ||
| JP3241504B2 (ja) | リジッドフレックスプリント配線板及びその製造方法 | |
| JPH0771839B2 (ja) | 積層板の製造方法 | |
| JPH02277298A (ja) | プリント配線板の製造方法 | |
| JPH09123345A (ja) | 銅張積層板 | |
| JPH06260765A (ja) | 多層配線基板及び多層配線板の製造方法 | |
| JPS62295930A (ja) | 積層板の製造方法 | |
| JPH06252549A (ja) | 接着剤被覆積層板の製造方法 | |
| JPH0371691A (ja) | 配線基板 | |
| JPH03279470A (ja) | 積層板用不織布基材ならびに積層板および積層板の製造 | |
| JPH02277295A (ja) | プリント配線板の製造方法 | |
| JPH03285391A (ja) | 多層配線基板の製造方法 | |
| JPH02277293A (ja) | プリント配線板の製造方法 | |
| JPH02277287A (ja) | プリント配線板の製造方法 | |
| JPH0239486A (ja) | 折曲げ加工用金属芯プリンタ基板の製造方法 | |
| JPH03155189A (ja) | 多層配線基板の製造方法 | |
| JPH05162245A (ja) | 積層板 | |
| JPH02277296A (ja) | プリント配線板の製造方法 | |
| JPS6256583A (ja) | 積層板 |