JPH0481473A - 画像形成用樹脂組成物および蛍光検出方式自動外観検査方法 - Google Patents

画像形成用樹脂組成物および蛍光検出方式自動外観検査方法

Info

Publication number
JPH0481473A
JPH0481473A JP2196508A JP19650890A JPH0481473A JP H0481473 A JPH0481473 A JP H0481473A JP 2196508 A JP2196508 A JP 2196508A JP 19650890 A JP19650890 A JP 19650890A JP H0481473 A JPH0481473 A JP H0481473A
Authority
JP
Japan
Prior art keywords
resin composition
image
meth
fluorescence
forming resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2196508A
Other languages
English (en)
Japanese (ja)
Inventor
Kenji Kushi
憲治 串
Kenichi Inukai
健一 犬飼
Takayuki Izeki
井関　隆幸
Seiya Koyanagi
精也 小柳
Yasuyuki Fujimoto
藤本　保之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Rayon Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Rayon Co Ltd filed Critical Mitsubishi Rayon Co Ltd
Priority to JP2196508A priority Critical patent/JPH0481473A/ja
Priority to EP91402029A priority patent/EP0469957B1/en
Priority to DE69123658T priority patent/DE69123658T2/de
Priority to TW080105721A priority patent/TW211024B/zh
Priority to CA002047621A priority patent/CA2047621C/en
Priority to KR1019910012848A priority patent/KR0177165B1/ko
Publication of JPH0481473A publication Critical patent/JPH0481473A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/04—Chromates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Paints Or Removers (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP2196508A 1990-07-25 1990-07-25 画像形成用樹脂組成物および蛍光検出方式自動外観検査方法 Pending JPH0481473A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2196508A JPH0481473A (ja) 1990-07-25 1990-07-25 画像形成用樹脂組成物および蛍光検出方式自動外観検査方法
EP91402029A EP0469957B1 (en) 1990-07-25 1991-07-22 Resin composition for image formation
DE69123658T DE69123658T2 (de) 1990-07-25 1991-07-22 Harzzusammensetzung zur Bildherstellung
TW080105721A TW211024B (enExample) 1990-07-25 1991-07-23
CA002047621A CA2047621C (en) 1990-07-25 1991-07-23 Resin composition for image formation
KR1019910012848A KR0177165B1 (ko) 1990-07-25 1991-07-25 화상 형성 수지 조성물

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2196508A JPH0481473A (ja) 1990-07-25 1990-07-25 画像形成用樹脂組成物および蛍光検出方式自動外観検査方法

Publications (1)

Publication Number Publication Date
JPH0481473A true JPH0481473A (ja) 1992-03-16

Family

ID=16358922

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2196508A Pending JPH0481473A (ja) 1990-07-25 1990-07-25 画像形成用樹脂組成物および蛍光検出方式自動外観検査方法

Country Status (6)

Country Link
EP (1) EP0469957B1 (enExample)
JP (1) JPH0481473A (enExample)
KR (1) KR0177165B1 (enExample)
CA (1) CA2047621C (enExample)
DE (1) DE69123658T2 (enExample)
TW (1) TW211024B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6187417B1 (en) 1998-02-18 2001-02-13 International Business Machines Corporation Substrate having high optical contrast and method of making same

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2812300B1 (fr) * 2000-07-28 2003-01-10 Cypher Science Encre liquide securisee revelable optiquement et procede de marquage de produits par une telle encre
AT10237U1 (de) * 2007-10-12 2008-11-15 Austria Tech & System Tech Verfahren und vorrichtung zum positionieren und ausrichten eines gegenstand relativ zu bzw. mit einem untergrund sowie verwendung hiefür
DE102011018725A1 (de) * 2011-04-20 2012-10-25 Carl Zeiss Jena Gmbh Optische Anordnung zur Erfassung der Lumineszenz von Proben

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2004262C3 (de) * 1970-01-30 1975-01-09 Philips Patentverwaltung Gmbh, 2000 Hamburg Projektionsschirm für granulationsfreie Laserstrahlprojektion

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6187417B1 (en) 1998-02-18 2001-02-13 International Business Machines Corporation Substrate having high optical contrast and method of making same

Also Published As

Publication number Publication date
CA2047621A1 (en) 1992-01-26
EP0469957B1 (en) 1996-12-18
TW211024B (enExample) 1993-08-11
KR920003101A (ko) 1992-02-29
EP0469957A1 (en) 1992-02-05
CA2047621C (en) 1996-07-02
DE69123658D1 (de) 1997-01-30
DE69123658T2 (de) 1997-07-03
KR0177165B1 (ko) 1999-04-01

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