JPH0477270U - - Google Patents
Info
- Publication number
- JPH0477270U JPH0477270U JP12030090U JP12030090U JPH0477270U JP H0477270 U JPH0477270 U JP H0477270U JP 12030090 U JP12030090 U JP 12030090U JP 12030090 U JP12030090 U JP 12030090U JP H0477270 U JPH0477270 U JP H0477270U
- Authority
- JP
- Japan
- Prior art keywords
- electrode body
- light
- electrode
- light emitting
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 238000001579 optical reflectometry Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
第1図は本考案の一実施例を示すドツトマトリ
ツクス型発光ダイオード装置の平面図、第2図は
その底面図、第3図は発光ダイオードチツプを含
む部分断面図、第4図は第1図の−線に沿う
断面図、第5図は凹部及びスルーホールの幾何学
的位置を示す説明図である。 1……絶縁性基板、2……発光ダイオードチツ
プ、3……リード細線、6……凹部、7……仮想
正四角形、8……側壁面、10……第1の電極体
、11……第2の電極体、17……電極体接続用
導体。
ツクス型発光ダイオード装置の平面図、第2図は
その底面図、第3図は発光ダイオードチツプを含
む部分断面図、第4図は第1図の−線に沿う
断面図、第5図は凹部及びスルーホールの幾何学
的位置を示す説明図である。 1……絶縁性基板、2……発光ダイオードチツ
プ、3……リード細線、6……凹部、7……仮想
正四角形、8……側壁面、10……第1の電極体
、11……第2の電極体、17……電極体接続用
導体。
Claims (1)
- 【実用新案登録請求の範囲】 絶縁性基板の一方の主面に横方向と縦方向にそ
れぞれ複数個の凹部を形成し、該凹部の各々に発
光素子を配置した発光表示装置において、 前記絶縁性基板の一方の主面上に形成される仮
想多角形の頂点に前記凹部を形成し、該凹部に光
反射性を有する第1の電極体と第2の電極体を互
いに離間させて形成し、前記発光素子の下面に形
成された電極を前記第1の電極体に固着し、前記
発光素子の上面に形成された電極と前記第2の電
極体とをリード細線を介して電気的に接続し、前
記絶縁性基板の前記仮想多角形の対角線の交差点
近傍にスルーホールを形成し、該スルーホールに
形成された導体層を介して前記絶縁性基板の他方
の主面に形成された電極体接続用導体に前記第1
の電極体又は前記第2の電極体を電気的に接続し
たことを特徴とする発光表示装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12030090U JP2531569Y2 (ja) | 1990-11-19 | 1990-11-19 | 発光表示装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12030090U JP2531569Y2 (ja) | 1990-11-19 | 1990-11-19 | 発光表示装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0477270U true JPH0477270U (ja) | 1992-07-06 |
JP2531569Y2 JP2531569Y2 (ja) | 1997-04-02 |
Family
ID=31868213
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12030090U Expired - Lifetime JP2531569Y2 (ja) | 1990-11-19 | 1990-11-19 | 発光表示装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2531569Y2 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07199829A (ja) * | 1993-12-28 | 1995-08-04 | Harrison Denki Kk | 発光ユニットおよび表示装置ならびに照明装置 |
JP2013197439A (ja) * | 2012-03-22 | 2013-09-30 | Koito Mfg Co Ltd | 発光モジュールおよび車両用灯具 |
US9812495B2 (en) | 2016-03-08 | 2017-11-07 | Panasonic Intellectual Property Management Co., Ltd. | Light emitting device and lighting apparatus |
-
1990
- 1990-11-19 JP JP12030090U patent/JP2531569Y2/ja not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07199829A (ja) * | 1993-12-28 | 1995-08-04 | Harrison Denki Kk | 発光ユニットおよび表示装置ならびに照明装置 |
JP2013197439A (ja) * | 2012-03-22 | 2013-09-30 | Koito Mfg Co Ltd | 発光モジュールおよび車両用灯具 |
US9812495B2 (en) | 2016-03-08 | 2017-11-07 | Panasonic Intellectual Property Management Co., Ltd. | Light emitting device and lighting apparatus |
Also Published As
Publication number | Publication date |
---|---|
JP2531569Y2 (ja) | 1997-04-02 |