JPH0474868B2 - - Google Patents

Info

Publication number
JPH0474868B2
JPH0474868B2 JP58052431A JP5243183A JPH0474868B2 JP H0474868 B2 JPH0474868 B2 JP H0474868B2 JP 58052431 A JP58052431 A JP 58052431A JP 5243183 A JP5243183 A JP 5243183A JP H0474868 B2 JPH0474868 B2 JP H0474868B2
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit chip
substrate
network
conductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58052431A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59178768A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5243183A priority Critical patent/JPS59178768A/ja
Publication of JPS59178768A publication Critical patent/JPS59178768A/ja
Publication of JPH0474868B2 publication Critical patent/JPH0474868B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP5243183A 1983-03-30 1983-03-30 複合部品 Granted JPS59178768A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5243183A JPS59178768A (ja) 1983-03-30 1983-03-30 複合部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5243183A JPS59178768A (ja) 1983-03-30 1983-03-30 複合部品

Publications (2)

Publication Number Publication Date
JPS59178768A JPS59178768A (ja) 1984-10-11
JPH0474868B2 true JPH0474868B2 (un) 1992-11-27

Family

ID=12914566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5243183A Granted JPS59178768A (ja) 1983-03-30 1983-03-30 複合部品

Country Status (1)

Country Link
JP (1) JPS59178768A (un)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63261904A (ja) * 1987-04-20 1988-10-28 Matsushita Electric Ind Co Ltd 搬送波検出用混成集積回路
JPS6413137U (un) * 1987-06-23 1989-01-24
JP2571389B2 (ja) * 1987-09-03 1997-01-16 ティーディーケイ株式会社 積層型混成集積回路部品
JP2790640B2 (ja) * 1989-01-14 1998-08-27 ティーディーケイ株式会社 混成集積回路部品の構造
JPH02102737U (un) * 1989-02-02 1990-08-15

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49120160A (un) * 1973-03-26 1974-11-16
JPS568854A (en) * 1979-07-04 1981-01-29 Mitsubishi Electric Corp Package for semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49120160A (un) * 1973-03-26 1974-11-16
JPS568854A (en) * 1979-07-04 1981-01-29 Mitsubishi Electric Corp Package for semiconductor device

Also Published As

Publication number Publication date
JPS59178768A (ja) 1984-10-11

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