JPH0468546U - - Google Patents

Info

Publication number
JPH0468546U
JPH0468546U JP11232390U JP11232390U JPH0468546U JP H0468546 U JPH0468546 U JP H0468546U JP 11232390 U JP11232390 U JP 11232390U JP 11232390 U JP11232390 U JP 11232390U JP H0468546 U JPH0468546 U JP H0468546U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
invar
copper
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11232390U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11232390U priority Critical patent/JPH0468546U/ja
Publication of JPH0468546U publication Critical patent/JPH0468546U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】
第１図は本考案の実施例を示す断面図、第２図
は従来例を示す断面図である。 １は基板、２はヒートシンク、３は半導体素子
、４は封止樹脂である。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 混成集積回路基板上に銅、インバー、銅あ
    るいはインバー、銅、インバーの積層構造からな
    るヒートシンクを介してチツプ状のパワー半導体
    素子が固着される混成集積回路において、 前記ヒートシンクの上面積と前記パワー半導体
    素子の面積が実質的に同一の大きさであつて、前
    記パワー半導体素子および前記ヒートシンクを封
    止樹脂で完全密封封止したことを特徴とする混成
    集積回路。 (2) 前記混成集積回路基板は絶縁金属基板を用
    いたことを特徴とする請求項１記載の混成集積回
    路。
JP11232390U 1990-10-25 1990-10-25 Pending JPH0468546U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11232390U JPH0468546U (ja) 1990-10-25 1990-10-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11232390U JPH0468546U (ja) 1990-10-25 1990-10-25

Publications (1)

Publication Number Publication Date
JPH0468546U true JPH0468546U (ja) 1992-06-17

Family

ID=31859825

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11232390U Pending JPH0468546U (ja) 1990-10-25 1990-10-25

Country Status (1)

Country Link
JP (1) JPH0468546U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6320449B2 (ja) * 1984-03-19 1988-04-27 Toray Industries

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6320449B2 (ja) * 1984-03-19 1988-04-27 Toray Industries

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