JPS62101234U - - Google Patents
Info
- Publication number
- JPS62101234U JPS62101234U JP1985192324U JP19232485U JPS62101234U JP S62101234 U JPS62101234 U JP S62101234U JP 1985192324 U JP1985192324 U JP 1985192324U JP 19232485 U JP19232485 U JP 19232485U JP S62101234 U JPS62101234 U JP S62101234U
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- dielectric
- ceramic substrate
- integrated circuit
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000003989 dielectric material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
図面は本考案の一実施例たる混成集積回路の縦
断面図である。 １…セラミツク基板、２…回路、５…誘電体、
６…ハンダ封止用導体、７…被ハンダ付け部材、
８…第１の導体（Ａｇ―Ｐｔ系）、９…第２の導
体（Ａｇ―Ｐｄ系）、１０…ハンダ。
断面図である。 １…セラミツク基板、２…回路、５…誘電体、
６…ハンダ封止用導体、７…被ハンダ付け部材、
８…第１の導体（Ａｇ―Ｐｔ系）、９…第２の導
体（Ａｇ―Ｐｄ系）、１０…ハンダ。
Claims (1)
- セラミツク基板上に導体と誘電体を厚膜法によ
り所望の回路に形成してなる混成集積回路におい
て、前記セラミツク基板もしくは誘電体上に所望
の形状に形成されたＡｇ―Ｐｔ系の第１の導体と
、該第１の導体上に形成されたＡｇ―Ｐｄ系の第
２の導体とを備え、前記第２の導体の所望箇所に
ハンダを介して被ハンダ付部材を固着したことを
特徴とする混成集積回路。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985192324U JPH0341475Y2 (ja) | 1985-12-16 | 1985-12-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985192324U JPH0341475Y2 (ja) | 1985-12-16 | 1985-12-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62101234U true JPS62101234U (ja) | 1987-06-27 |
| JPH0341475Y2 JPH0341475Y2 (ja) | 1991-08-30 |
Family
ID=31147295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985192324U Expired JPH0341475Y2 (ja) | 1985-12-16 | 1985-12-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0341475Y2 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0396047U (ja) * | 1990-01-22 | 1991-10-01 |
-
1985
- 1985-12-16 JP JP1985192324U patent/JPH0341475Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0396047U (ja) * | 1990-01-22 | 1991-10-01 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0341475Y2 (ja) | 1991-08-30 |