JPH0466382B2 - - Google Patents

Info

Publication number
JPH0466382B2
JPH0466382B2 JP62227261A JP22726187A JPH0466382B2 JP H0466382 B2 JPH0466382 B2 JP H0466382B2 JP 62227261 A JP62227261 A JP 62227261A JP 22726187 A JP22726187 A JP 22726187A JP H0466382 B2 JPH0466382 B2 JP H0466382B2
Authority
JP
Japan
Prior art keywords
resin
mold
metal frame
head
emitting diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62227261A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6469020A (en
Inventor
Toshiharu Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissei Plastic Industrial Co Ltd
Original Assignee
Nissei Plastic Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissei Plastic Industrial Co Ltd filed Critical Nissei Plastic Industrial Co Ltd
Priority to JP62227261A priority Critical patent/JPS6469020A/ja
Publication of JPS6469020A publication Critical patent/JPS6469020A/ja
Publication of JPH0466382B2 publication Critical patent/JPH0466382B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
JP62227261A 1987-09-10 1987-09-10 Method of sealing light-emitting diode with resin Granted JPS6469020A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62227261A JPS6469020A (en) 1987-09-10 1987-09-10 Method of sealing light-emitting diode with resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62227261A JPS6469020A (en) 1987-09-10 1987-09-10 Method of sealing light-emitting diode with resin

Publications (2)

Publication Number Publication Date
JPS6469020A JPS6469020A (en) 1989-03-15
JPH0466382B2 true JPH0466382B2 (enrdf_load_stackoverflow) 1992-10-23

Family

ID=16858049

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62227261A Granted JPS6469020A (en) 1987-09-10 1987-09-10 Method of sealing light-emitting diode with resin

Country Status (1)

Country Link
JP (1) JPS6469020A (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0632511A3 (en) * 1993-06-29 1996-11-27 Mitsubishi Cable Ind Ltd Light emitting diode assembly and manufacturing method.
US5658096A (en) * 1994-02-17 1997-08-19 Sytec Bausystm Ag Embankment element for stabilizing or supporting a slope
DE10163117C5 (de) 2001-12-24 2005-12-01 G.L.I. Global Light Industries Gmbh Verfahren zum Herstellen von lichtleitenden LED-Körpern in zwei zeitlich getrennten Stufen
DE10163116B4 (de) * 2001-12-24 2008-04-10 G.L.I. Global Light Industries Gmbh Verfahren zum Herstellen von lichtleitenden LED-Körpern in zwei räumlich und zeitlich getrennten Stufen
DE10242947B8 (de) * 2002-09-16 2009-06-18 Odelo Led Gmbh Verfahren zum Herstellen von LED-Körpern mit Hilfe einer Querschnittsverengung und Vorrichtung zur Durchführung des Herstellungsverfahrens
JP2009302431A (ja) * 2008-06-17 2009-12-24 Panasonic Corp 光半導体装置用パッケージと製造方法および光半導体装置

Also Published As

Publication number Publication date
JPS6469020A (en) 1989-03-15

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