JPS6469020A - Method of sealing light-emitting diode with resin - Google Patents

Method of sealing light-emitting diode with resin

Info

Publication number
JPS6469020A
JPS6469020A JP62227261A JP22726187A JPS6469020A JP S6469020 A JPS6469020 A JP S6469020A JP 62227261 A JP62227261 A JP 62227261A JP 22726187 A JP22726187 A JP 22726187A JP S6469020 A JPS6469020 A JP S6469020A
Authority
JP
Japan
Prior art keywords
resin
cavity
section
head section
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62227261A
Other languages
Japanese (ja)
Other versions
JPH0466382B2 (en
Inventor
Toshiharu Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissei Plastic Industrial Co Ltd
Original Assignee
Nissei Plastic Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissei Plastic Industrial Co Ltd filed Critical Nissei Plastic Industrial Co Ltd
Priority to JP62227261A priority Critical patent/JPS6469020A/en
Publication of JPS6469020A publication Critical patent/JPS6469020A/en
Publication of JPH0466382B2 publication Critical patent/JPH0466382B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE:To enable a light-emitting diode to be sealed with a material having high flowability and high transparency, by conducting first injection molding for preliminarily forming a head section sealing the tip end of a metal frame with resin together with the light-emitting diode and a wire and then conducting second injection molding of a heat-resisting resin for forming a body section integrally under the head section so that the resin sealing body is composed of the head section having a lens face and the body section. CONSTITUTION:A metal frame 1 is disposed on a stationary part 11a of a primary mold 11 while the tip end of the frame is inserted into a cavity 13. First resin is injected into the cavity 13 slowly under a low pressure by an injector 23 to form a sealing body head 30 having a lens face, whereby the tip end of the frame is sealed primarily. After the resin is cooled and cured, the frame is removed from the mold and transferred to a secondary mold 12. The head section 30 is inserted into a cavity 14 while the lens face thereof is set at the position corresponding to the mold surface of a slide core 16. Then, a cavity for forming body section is defined between the head section 30 and a stationary part 12a and between the head section and a movable part 12b. Resin is injected to the cavity 14 by an injector 24 to form a body section 31 while, simultaneously therewith, a sealing body 32 is formed integrally with the body section 31.
JP62227261A 1987-09-10 1987-09-10 Method of sealing light-emitting diode with resin Granted JPS6469020A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62227261A JPS6469020A (en) 1987-09-10 1987-09-10 Method of sealing light-emitting diode with resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62227261A JPS6469020A (en) 1987-09-10 1987-09-10 Method of sealing light-emitting diode with resin

Publications (2)

Publication Number Publication Date
JPS6469020A true JPS6469020A (en) 1989-03-15
JPH0466382B2 JPH0466382B2 (en) 1992-10-23

Family

ID=16858049

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62227261A Granted JPS6469020A (en) 1987-09-10 1987-09-10 Method of sealing light-emitting diode with resin

Country Status (1)

Country Link
JP (1) JPS6469020A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0632511A2 (en) * 1993-06-29 1995-01-04 MITSUBISHI CABLE INDUSTRIES, Ltd. A light emitting diode aggregate module and a method for manufacturing a light emitting diode aggregate module
US5658096A (en) * 1994-02-17 1997-08-19 Sytec Bausystm Ag Embankment element for stabilizing or supporting a slope
WO2003056637A2 (en) * 2001-12-24 2003-07-10 G.L.I. Global Light Industries Gmbh Method for producing light-guiding led bodies in two spatially and temporally separate steps
WO2004027883A1 (en) * 2002-09-16 2004-04-01 G.L.I. Global Light Industries Gmbh Method for producing led bodies with the aid of a cross-sectional restriction
DE10163117C5 (en) * 2001-12-24 2005-12-01 G.L.I. Global Light Industries Gmbh Process for producing light-conducting LED bodies in two time-separated stages
JP2009302431A (en) * 2008-06-17 2009-12-24 Panasonic Corp Package for optical semiconductor device, manufacturing method and optical semiconductor device

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0632511A2 (en) * 1993-06-29 1995-01-04 MITSUBISHI CABLE INDUSTRIES, Ltd. A light emitting diode aggregate module and a method for manufacturing a light emitting diode aggregate module
EP0632511A3 (en) * 1993-06-29 1996-11-27 Mitsubishi Cable Ind Ltd A light emitting diode aggregate module and a method for manufacturing a light emitting diode aggregate module.
US5658096A (en) * 1994-02-17 1997-08-19 Sytec Bausystm Ag Embankment element for stabilizing or supporting a slope
WO2003056637A3 (en) * 2001-12-24 2004-06-03 G L I Global Light Ind Gmbh Method for producing light-guiding led bodies in two spatially and temporally separate steps
DE10163116A1 (en) * 2001-12-24 2003-07-17 Reitter & Schefenacker Gmbh Process for producing light-guiding LED bodies in two spatially and temporally separate stages
WO2003056637A2 (en) * 2001-12-24 2003-07-10 G.L.I. Global Light Industries Gmbh Method for producing light-guiding led bodies in two spatially and temporally separate steps
DE10163117C5 (en) * 2001-12-24 2005-12-01 G.L.I. Global Light Industries Gmbh Process for producing light-conducting LED bodies in two time-separated stages
US7232536B2 (en) 2001-12-24 2007-06-19 G.L.I. Global Light Industries Gmbh Method for producing light-guiding LED bodies in two spatially and temporally separate steps
US7267791B2 (en) 2001-12-24 2007-09-11 G.L.I. Global Light Industries Gmbh Method for the production of light-guiding LED bodies in two chronologically separate stages
DE10163116B4 (en) * 2001-12-24 2008-04-10 G.L.I. Global Light Industries Gmbh Method for producing light-conducting LED bodies in two spatially and temporally separate stages
WO2004027883A1 (en) * 2002-09-16 2004-04-01 G.L.I. Global Light Industries Gmbh Method for producing led bodies with the aid of a cross-sectional restriction
US7241637B2 (en) 2002-09-16 2007-07-10 G.L.I. Global Light Industries Gmbh Method of producing LED bodies with the aid of a cross-sectional constriction
JP2009302431A (en) * 2008-06-17 2009-12-24 Panasonic Corp Package for optical semiconductor device, manufacturing method and optical semiconductor device

Also Published As

Publication number Publication date
JPH0466382B2 (en) 1992-10-23

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