JPH0466382B2 - - Google Patents
Info
- Publication number
- JPH0466382B2 JPH0466382B2 JP62227261A JP22726187A JPH0466382B2 JP H0466382 B2 JPH0466382 B2 JP H0466382B2 JP 62227261 A JP62227261 A JP 62227261A JP 22726187 A JP22726187 A JP 22726187A JP H0466382 B2 JPH0466382 B2 JP H0466382B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- metal frame
- head
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 26
- 239000011347 resin Substances 0.000 claims description 26
- 238000000465 moulding Methods 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 238000007789 sealing Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 10
- 238000001746 injection moulding Methods 0.000 claims description 8
- 229920006015 heat resistant resin Polymers 0.000 claims description 2
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 241000252084 Anguilla Species 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明はメタルフレームの先端部に設けられ
た発光ダイオードを射出形成を用いて樹脂封止す
る方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method of resin-sealing a light emitting diode provided at the tip of a metal frame using injection molding.
一般に発光ダイオード（以下LEDと称する）
の樹脂封止は注型成形法を用いて行われている。
Generally light emitting diode (hereinafter referred to as LED)
Resin sealing is performed using a cast molding method.
この方法はポツト状の型内にエポキシ樹脂など
熱硬化性樹脂を加熱溶融して注入し、その樹脂に
LEDチツプをダイボンデイング及びワイヤーボ
ンデイングしたメタルフレームの先端を挿入し、
その状態を維持しながら炉内で樹脂の加熱硬化を
行い、しかるのち型から樹脂を離型して製品を得
る多段の工程を要するものであつた。 This method involves heating and melting thermosetting resin such as epoxy resin and injecting it into a pot-shaped mold.
Insert the tip of the metal frame with the LED chip die-bonded and wire-bonded,
This required a multi-step process of heating and curing the resin in a furnace while maintaining this state, and then releasing the resin from the mold to obtain a product.
上記注型成形法では、硬化時間が長く、全工程
を完了するまでに約24時間を要し、これがため生
産性が悪く、連続して生産を行うためには24時間
分のストツクを有する大規模な設備を必要とす
る。 The cast molding method described above has a long curing time, requiring approximately 24 hours to complete the entire process, resulting in poor productivity. Requires large-scale equipment.
更にこの成形法では、樹脂に圧力がほととんど
加えられないため、寸法精度が悪く、メタルフレ
ームをインサートしたときにエアーを巻き込み易
い他、メタルフレームを中心に固定しておくのが
困難で偏心しやすい問題点があつた。 Furthermore, with this molding method, almost no pressure is applied to the resin, so dimensional accuracy is poor, air is easily drawn in when the metal frame is inserted, and it is difficult to keep the metal frame centered. There was a problem where it was easy to become eccentric.
そこで最近では、射出成形により金型内にメタ
ルフレームをインサートし、キヤビテイ内に樹脂
を射出充填して、LEDの樹脂封止を行うことが
試みられている。 Recently, attempts have been made to insert a metal frame into a mold by injection molding, inject and fill the cavity with resin, and seal the LED with resin.
しかし、射出成形では注型成形に比較して、高
速、高圧で樹脂の充填が行われるため、その際の
樹脂の流動等により、ワイヤーボンデイングされ
た金線（φ0.02mm）が破断してしまうことがあり、
これを防止するために低速、低圧にて射出を行う
とフローマーク、ウエルドライン等の成形不良が
生じ、歩留りが悪くなつて量産には適さぬなどの
問題があつた。
However, in injection molding, the resin is filled at a higher speed and pressure than in cast molding, so the wire-bonded gold wire (φ0.02 mm) breaks due to the flow of the resin. Sometimes,
In order to prevent this, injection is performed at low speed and low pressure, resulting in molding defects such as flow marks and weld lines, resulting in poor yields and unsuitability for mass production.
また上記問題を解決するために、流動性の良い
樹脂を用いることが考えられるが、流動性の良い
材料は多くの場合、熱変形温度が低く、半田耐熱
試験を合格することができないので、実用性に欠
ける。 In addition, in order to solve the above problem, it is possible to use a resin with good fluidity, but in many cases, materials with good fluidity have a low heat distortion temperature and cannot pass the soldering heat resistance test, so it is difficult to put it into practical use. Lacks sex.
この発明はかかる樹脂封止の問題点を解決する
ために考えられたものであつて、その目的は樹脂
封止体を２つの部分から構成することによつて、
流動性のよい樹脂をも発光ダイオードの樹脂封止
に用いることができる新たな方法を提供すること
にある。 This invention was devised in order to solve the problems of resin sealing, and its purpose is to construct a resin sealing body from two parts.
The object of the present invention is to provide a new method in which even a resin with good fluidity can be used for resin encapsulation of a light emitting diode.
上記目的によるこの発明は、メタルフレームの
先端部にダイボンデイング及びワイヤーボンデイ
ングされた発光ダイオードのチツプをワイヤーと
共に樹脂封止するに当り、樹脂封止体をレンズ面
を有する頭部と胴部との２つの部分から構成し、
頭部の射出成形を先行してメタルフレーム先端部
を発光ダイオード及びワイヤーと共に樹脂封止
し、しかるのに頭部下側にメタルフレームを内包
する胴部を耐熱性樹脂により射出成形するととも
に、該胴部と頭部とを一体化して樹脂封止体を形
成し、これにより上記問題点を解決してなるもの
である。
According to the above-mentioned object, the present invention is used to seal a light-emitting diode chip, which has been die-bonded and wire-bonded to the tip of a metal frame, with a wire, by connecting a resin-sealed body to a head portion having a lens surface and a body portion. Consisting of two parts,
Prior to the injection molding of the head, the tip of the metal frame is sealed with resin along with the light emitting diode and wire, and then the body containing the metal frame at the bottom of the head is injection molded with heat-resistant resin. The body and the head are integrated to form a resin-sealed body, thereby solving the above-mentioned problems.
第１図はこの発明を実施し得る竪型の射出成形
機を示すもので、機台２１上に立設した直圧式型
締装置２２と、機台２１上に並設された一次成形
用と二次成形用の２組の金型１１，１２の固定型
１１ａ，１２ｂに、それぞれ対向して並列に設け
られた２基のインラインスクリユ式射出装置２
３，２４を有し、上方の型締盤２５の下側面に可
動型１１ｂ，１２ｂが並設してある。
FIG. 1 shows a vertical injection molding machine in which the present invention can be carried out, in which a direct pressure mold clamping device 22 is installed upright on a machine stand 21, and a primary molding machine is installed in parallel on the machine stand 21. Two in-line screw injection devices 2 are installed in parallel and facing each other in fixed molds 11a and 12b of two sets of molds 11 and 12 for secondary molding.
3 and 24, and movable molds 11b and 12b are arranged side by side on the lower surface of the upper mold clamping plate 25.
上記金型１１，１２のキヤビテイ１３，１４
は、それぞれ固定型１１ａ，１２ａ及び可動型１
１ｂ，１２ｂと、その両型の間に横方向に摺動自
在に設けたスライドコア１５，１６とから形成さ
れ、可動型内の樹脂路１７，１８からキヤビテイ
１３，１４に樹脂を射出充填することができるよ
うになつている。 Cavities 13 and 14 of the molds 11 and 12
are the fixed molds 11a, 12a and the movable mold 1, respectively.
1b, 12b and slide cores 15, 16 which are slidably provided laterally between the two molds, and resin is injected and filled into the cavities 13, 14 from resin paths 17, 18 in the movable mold. It is now possible to do so.
また各スライドコア１５，１６の型面は、半円
形に形成され、一次成形金型側ではスライドコア
１４の型面によつてLEDのレンズ面が形成され、
二次成形金型側ではそのレンズ面を受けることが
できるようになつている。 Furthermore, the mold surface of each slide core 15, 16 is formed in a semicircular shape, and the lens surface of the LED is formed by the mold surface of the slide core 14 on the primary molding die side.
The lens surface can be received on the secondary molding die side.
なお１９，２０はアンギユラピンである。 Note that 19 and 20 are anguillapine.
上記第１の射出装置２３には流動性、光学特性
に優れた樹脂材料（例えばポリカーボネイト、ポ
リメチルペンテン、ポリアリレート等）が供給さ
れ、第２の射出装置２４には耐熱性に優れた樹脂
材料（例えばポリフエニルレンスルフアイド、ガ
ラス入ポリフエニレンスルフアイド、液晶ポリマ
ー：ポリプラスチツク株式会社製ベクトラA130、
A410、C130等）が供給される。 The first injection device 23 is supplied with a resin material having excellent fluidity and optical properties (for example, polycarbonate, polymethylpentene, polyarylate, etc.), and the second injection device 24 is supplied with a resin material having excellent heat resistance. (For example, polyphenylene sulfide, glass-filled polyphenylene sulfide, liquid crystal polymer: Vectra A130 manufactured by Polyplastics Co., Ltd.,
A410, C130, etc.) are supplied.
上記射出成形機に用いてメタルフレーム１の先
端部と共に、その先端にダイボンデイング及びワ
イヤーボンデイングされた発光ダイオード２及び
ワイヤー３とを樹脂封止するには、まず一次成形
金型１１の固定型１１ａにメタルフレーム１を載
せて先端部をキヤビテイ１３に挿填する。次に型
締を行つてキヤビテイ１３に第１の射出装置２３
より樹脂路１７を経て、上記ワイヤー３が切れな
い程度の低速、低圧により第１の樹脂を射出充填
し、レンズ面を有する封止体頭部３０を成形して
一次的封止を行う。そして樹脂の冷却固化完了後
に型開し、固定型より一次封止されたメタルフレ
ーム１取出して二次成形金型１２に移送する。 In order to resin-seal the tip of the metal frame 1 as well as the light emitting diode 2 and wire 3 that have been die-bonded and wire-bonded to the tip using the injection molding machine, first, the fixed mold 11a of the primary mold 11 is used. Place the metal frame 1 on the metal frame 1 and insert the tip into the cavity 13. Next, the mold is clamped and the first injection device 23 is inserted into the cavity 13.
After passing through the resin path 17, the first resin is injected and filled at a low speed and pressure that does not break the wire 3, and a sealing body head 30 having a lens surface is formed to perform primary sealing. After the resin has been cooled and solidified, the mold is opened, and the metal frame 1 which has been sealed primarily is taken out from the fixed mold and transferred to the secondary molding mold 12.
移送後、封止体頭部３０をキヤビテイ１４に挿
填し、レンズ面をスライドコア１６の型面と一致
する位置にセツトする。セツテングが完了した後
に型閉じを行うと、スライコア１６の型面によつ
てレンズ面を受け止められ、また封止体頭部３０
と固定型１２ａ及び可動型１２ｂとの間に胴部成
形用のキヤビテイが形成される。 After the transfer, the sealing body head 30 is inserted into the cavity 14 and the lens surface is set at a position that matches the mold surface of the slide core 16. When the mold is closed after the setting is completed, the lens surface is received by the mold surface of the slide core 16, and the sealing body head 30
A cavity for molding the body is formed between the fixed mold 12a and the movable mold 12b.
そこで、第２の射出装置２４から可動型１２ｂ
の樹脂路１８を経て、キヤビテイ１４に樹脂を高
速、高圧により射出充填し、封止体胴部３１を成
形すると同時に、封止体頭部３０と一体化して封
止体３２を完成する。完成品は二次成形金型１２
を型開した後に離型されて他に移送され、その後
に一次成形金型から一次成形を行つた新たなメタ
ルフレームが送られて来る。 Therefore, from the second injection device 24 to the movable mold 12b.
The resin is injected into the cavity 14 through the resin path 18 at high speed and under high pressure to form the body 31 of the sealing body and at the same time integrate it with the head 30 of the sealing body to complete the sealing body 32. The finished product is a secondary molding mold 12
After the mold is opened, it is released and transported to another location, and then a new metal frame that has undergone primary molding is sent from the primary mold.
上記実施例では、スライドコアの型面をもつて
レンズ面を成形し、また成形されたレンズ面を二
次成形時に型面により受けるようにしたことか
ら、レンズ面にはパーテングラインが発生せず、
また二次成形時の圧力でレンズ面が変化するよう
なこともないので、光学特性が向上し、成形精度
も一段と向上する。 In the above example, the lens surface is molded using the mold surface of the slide core, and the molded lens surface is received by the mold surface during secondary molding, so no parting line is generated on the lens surface. figure,
Furthermore, since the lens surface does not change due to pressure during secondary molding, optical properties are improved and molding accuracy is further improved.
本発明によれば、LEDチツプ及びワイヤーの
部分を流動性、透明性に優れた材料に封止するこ
とができるので、ボンデイングワイヤーの破損、
ウエルドライン、フローマークの発生が防ぐこと
ができ、光学特性にも優れたLEDが得られる。
According to the present invention, since the LED chip and wire parts can be sealed with a material with excellent fluidity and transparency, damage to the bonding wire can be avoided.
The generation of weld lines and flow marks can be prevented, and an LED with excellent optical properties can be obtained.
また胴部成形材料を白色のものとすることによ
り、下方に照射される光を反射させて上方に向け
ることができ、これにより更に一層輝度を向上さ
せることもできるなどの特長を有する。 Furthermore, by using a white material for forming the body, light emitted downward can be reflected and directed upward, which has the advantage of further improving brightness.
図面はこの発明に係る発光ダイオードの樹脂封
止方法の１実施例を示すもので、第１図は射出成
形機の略示斜視図、第２図から第５図は方法の工
程説明図、第６図は一次成形品の平面図、第７図
は完成品の平面図である。
１……メタルフレーム、２……発光ダイオー
ド、３……ワイヤー、１１……一次成形金型、１
２……二次成形金型、１１ａ，１２ａ……固定
型、１１ｂ，１２ｂ……可動型、１３，１４……
キヤビテイ、１５，１６……スライドコア、１
７，１８……樹脂路、１９，２０……アンギユラ
ピン、３０……封止体頭部、３１……封止体胴
部、３２……封止体。
The drawings show one embodiment of the method for resin-sealing a light-emitting diode according to the present invention, and FIG. 1 is a schematic perspective view of an injection molding machine, and FIGS. FIG. 6 is a plan view of the primary molded product, and FIG. 7 is a plan view of the finished product. 1... Metal frame, 2... Light emitting diode, 3... Wire, 11... Primary mold, 1
2... Secondary molding mold, 11a, 12a... Fixed mold, 11b, 12b... Movable mold, 13, 14...
Cavity, 15, 16...Slide core, 1
7, 18... Resin path, 19, 20... Anguilla pin, 30... Sealing body head, 31... Sealing body body, 32... Sealing body.
Claims (1)
及びワイヤーボンデイングされた発光ダイオード
のチツプをワイヤーと共に樹脂封止するに当り、
樹脂封止体をレンズ面を有する頭部と胴部との２
つの部分から構成し、頭部の射出成形を先行して
メタルフレーム先端部を発光ダイオード及びワイ
ヤーと共に樹脂封止し、しかるのち頭部下側にメ
タルフレームを内包する胴部を耐熱性樹脂により
射出成形するとともに、該胴部と頭部とを一体化
して樹脂封止体を形成してなることを特徴とする
発光ダイオードの樹脂封止方法。1. When sealing a light emitting diode chip die-bonded and wire-bonded to the tip of a metal frame with a resin,
The resin-sealed body has a head portion and a body portion each having a lens surface.
The tip of the metal frame is resin-sealed together with the light emitting diode and wires before injection molding of the head, and then the body containing the metal frame on the underside of the head is injected with heat-resistant resin. A method for resin-sealing a light-emitting diode, which comprises molding and integrating the body and head to form a resin-sealed body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62227261A JPS6469020A (en) | 1987-09-10 | 1987-09-10 | Method of sealing light-emitting diode with resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62227261A JPS6469020A (en) | 1987-09-10 | 1987-09-10 | Method of sealing light-emitting diode with resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6469020A JPS6469020A (en) | 1989-03-15 |
| JPH0466382B2 true JPH0466382B2 (en) | 1992-10-23 |
Family
ID=16858049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62227261A Granted JPS6469020A (en) | 1987-09-10 | 1987-09-10 | Method of sealing light-emitting diode with resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6469020A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0632511A3 (en) * | 1993-06-29 | 1996-11-27 | Mitsubishi Cable Ind Ltd | A light emitting diode aggregate module and a method for manufacturing a light emitting diode aggregate module. |
| US5658096A (en) * | 1994-02-17 | 1997-08-19 | Sytec Bausystm Ag | Embankment element for stabilizing or supporting a slope |
| DE10163116B4 (en) * | 2001-12-24 | 2008-04-10 | G.L.I. Global Light Industries Gmbh | Method for producing light-conducting LED bodies in two spatially and temporally separate stages |
| DE10163117C5 (en) | 2001-12-24 | 2005-12-01 | G.L.I. Global Light Industries Gmbh | Process for producing light-conducting LED bodies in two time-separated stages |
| DE10242947B8 (en) * | 2002-09-16 | 2009-06-18 | Odelo Led Gmbh | Method for producing LED bodies by means of a cross-sectional constriction and apparatus for carrying out the production method |
| JP2009302431A (en) * | 2008-06-17 | 2009-12-24 | Panasonic Corp | Package for optical semiconductor device, manufacturing method and optical semiconductor device |
-
1987
- 1987-09-10 JP JP62227261A patent/JPS6469020A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6469020A (en) | 1989-03-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO1995019251A1 (en) | Method of resin-sealing semiconductor devices | |
| JP5065747B2 (en) | Semiconductor package manufacturing method and manufacturing apparatus | |
| JPH0466382B2 (en) | ||
| CN109262981A (en) | One kind one mould, 512 cave optical lens mold and contour machining procedure | |
| JPH0440870B2 (en) | ||
| JP2019111692A (en) | Resin molding apparatus and method of manufacturing resin molded article | |
| JPH10270627A (en) | Manufacture of semiconductor device and lead frame | |
| JPH0342495B2 (en) | ||
| JPH04329680A (en) | Light emitting device | |
| JP2598988B2 (en) | Resin sealing molding method for electronic parts | |
| JP2000003923A (en) | Resin sealing of semiconductor device and resin-sealing device for that | |
| JPH06304973A (en) | Injection molding mold | |
| JP3795684B2 (en) | Resin sealing molding method for electronic parts | |
| JPH0466381B2 (en) | ||
| JP2631990B2 (en) | Mold for resin molding of electronic parts | |
| JP2609894B2 (en) | Transfer resin encapsulation molding method for parts to be encapsulated, resin encapsulation molding die apparatus and film carrier used therefor | |
| JP4167158B2 (en) | Optical element resin sealing device and resin sealing method | |
| JP2644551B2 (en) | Semiconductor device manufacturing method and apparatus for implementing the same | |
| JP2666630B2 (en) | Method for manufacturing semiconductor device | |
| JPH05166866A (en) | Method and apparatus for resin-sealing of electronic component, and lead frame | |
| JP3609821B1 (en) | Semiconductor device sealing mold and semiconductor device sealing method using the same | |
| JPS5827326A (en) | Resin sealing method of ic chips | |
| JPH10109330A (en) | Mold device, gate cutting, and manufacture of semiconductor integrated circuit device | |
| JP2000124241A (en) | Method of resin sealing and molding electronic components and die | |
| JPH1027814A (en) | Resin-sealed semiconductor device, method of resin-sealing that and resin-sealing metal mold |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |