JPH0440870B2 - - Google Patents

Info

Publication number
JPH0440870B2
JPH0440870B2 JP61277305A JP27730586A JPH0440870B2 JP H0440870 B2 JPH0440870 B2 JP H0440870B2 JP 61277305 A JP61277305 A JP 61277305A JP 27730586 A JP27730586 A JP 27730586A JP H0440870 B2 JPH0440870 B2 JP H0440870B2
Authority
JP
Japan
Prior art keywords
resin
mold
metal frame
tip
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61277305A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63129680A (ja
Inventor
Yoshiharu Shima
Toshiharu Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissei Plastic Industrial Co Ltd
Original Assignee
Nissei Plastic Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissei Plastic Industrial Co Ltd filed Critical Nissei Plastic Industrial Co Ltd
Priority to JP61277305A priority Critical patent/JPS63129680A/ja
Publication of JPS63129680A publication Critical patent/JPS63129680A/ja
Publication of JPH0440870B2 publication Critical patent/JPH0440870B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
JP61277305A 1986-11-20 1986-11-20 発光ダイオ−ドの樹脂封止方法 Granted JPS63129680A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61277305A JPS63129680A (ja) 1986-11-20 1986-11-20 発光ダイオ−ドの樹脂封止方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61277305A JPS63129680A (ja) 1986-11-20 1986-11-20 発光ダイオ−ドの樹脂封止方法

Publications (2)

Publication Number Publication Date
JPS63129680A JPS63129680A (ja) 1988-06-02
JPH0440870B2 true JPH0440870B2 (enrdf_load_stackoverflow) 1992-07-06

Family

ID=17581685

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61277305A Granted JPS63129680A (ja) 1986-11-20 1986-11-20 発光ダイオ−ドの樹脂封止方法

Country Status (1)

Country Link
JP (1) JPS63129680A (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5140384A (en) * 1990-06-14 1992-08-18 Rohm Co., Ltd. Semiconductor laser device mounted on a stem
US6677614B1 (en) * 1992-12-17 2004-01-13 Kabushiki Kaisha Toshiba Semiconductor light-emitting device and method for manufacturing the device
US6808950B2 (en) 1992-12-17 2004-10-26 Kabushiki Kaisha Toshiba Semiconductor light-emitting device and method for manufacturing the device
JP3541709B2 (ja) * 1998-02-17 2004-07-14 日亜化学工業株式会社 発光ダイオードの形成方法
JP3900144B2 (ja) * 1998-02-17 2007-04-04 日亜化学工業株式会社 発光ダイオードの形成方法
DE10163116B4 (de) * 2001-12-24 2008-04-10 G.L.I. Global Light Industries Gmbh Verfahren zum Herstellen von lichtleitenden LED-Körpern in zwei räumlich und zeitlich getrennten Stufen
CN112092281A (zh) * 2019-07-19 2020-12-18 江苏和睿半导体科技有限公司 一种塑封注塑工艺

Also Published As

Publication number Publication date
JPS63129680A (ja) 1988-06-02

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