DE10242947B8 - Verfahren zum Herstellen von LED-Körpern mit Hilfe einer Querschnittsverengung und Vorrichtung zur Durchführung des Herstellungsverfahrens - Google Patents

Verfahren zum Herstellen von LED-Körpern mit Hilfe einer Querschnittsverengung und Vorrichtung zur Durchführung des Herstellungsverfahrens Download PDF

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Publication number
DE10242947B8
DE10242947B8 DE10242947A DE10242947A DE10242947B8 DE 10242947 B8 DE10242947 B8 DE 10242947B8 DE 10242947 A DE10242947 A DE 10242947A DE 10242947 A DE10242947 A DE 10242947A DE 10242947 B8 DE10242947 B8 DE 10242947B8
Authority
DE
Germany
Prior art keywords
carrying
cross
sectional constriction
production method
producing led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE10242947A
Other languages
English (en)
Other versions
DE10242947A1 (de
DE10242947B4 (de
Inventor
Thomas Dr. Manth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ODELO LED GMBH, 47475 KAMP-LINTFORT, DE
Original Assignee
Odelo Led GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE10242947A priority Critical patent/DE10242947B8/de
Application filed by Odelo Led GmbH filed Critical Odelo Led GmbH
Priority to AU2003269827A priority patent/AU2003269827A1/en
Priority to US10/528,007 priority patent/US7241637B2/en
Priority to DE10393816T priority patent/DE10393816D2/de
Priority to PCT/DE2003/003060 priority patent/WO2004027883A1/de
Priority to CN03821974.3A priority patent/CN1682382A/zh
Publication of DE10242947A1 publication Critical patent/DE10242947A1/de
Application granted granted Critical
Publication of DE10242947B4 publication Critical patent/DE10242947B4/de
Publication of DE10242947B8 publication Critical patent/DE10242947B8/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0046—Details relating to the filling pattern or flow paths or flow characteristics of moulding material in the mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14836—Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/33—Moulds having transversely, e.g. radially, movable mould parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Led Device Packages (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
DE10242947A 2002-09-16 2002-09-16 Verfahren zum Herstellen von LED-Körpern mit Hilfe einer Querschnittsverengung und Vorrichtung zur Durchführung des Herstellungsverfahrens Expired - Fee Related DE10242947B8 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE10242947A DE10242947B8 (de) 2002-09-16 2002-09-16 Verfahren zum Herstellen von LED-Körpern mit Hilfe einer Querschnittsverengung und Vorrichtung zur Durchführung des Herstellungsverfahrens
US10/528,007 US7241637B2 (en) 2002-09-16 2003-09-15 Method of producing LED bodies with the aid of a cross-sectional constriction
DE10393816T DE10393816D2 (en) 2002-09-16 2003-09-15 Verfahren zum herstellen von led-körpern mit hilfe einer querschnittverengung
PCT/DE2003/003060 WO2004027883A1 (de) 2002-09-16 2003-09-15 Verfahren zum herstellen von led-körpern mit hilfe einer querschnittverengung
AU2003269827A AU2003269827A1 (en) 2002-09-16 2003-09-15 Method for producing led bodies with the aid of a cross-sectional restriction
CN03821974.3A CN1682382A (zh) 2002-09-16 2003-09-15 借助于横截面收缩制造发光二极管壳体的方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10242947A DE10242947B8 (de) 2002-09-16 2002-09-16 Verfahren zum Herstellen von LED-Körpern mit Hilfe einer Querschnittsverengung und Vorrichtung zur Durchführung des Herstellungsverfahrens

Publications (3)

Publication Number Publication Date
DE10242947A1 DE10242947A1 (de) 2004-03-25
DE10242947B4 DE10242947B4 (de) 2008-12-18
DE10242947B8 true DE10242947B8 (de) 2009-06-18

Family

ID=31896044

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10242947A Expired - Fee Related DE10242947B8 (de) 2002-09-16 2002-09-16 Verfahren zum Herstellen von LED-Körpern mit Hilfe einer Querschnittsverengung und Vorrichtung zur Durchführung des Herstellungsverfahrens
DE10393816T Expired - Lifetime DE10393816D2 (en) 2002-09-16 2003-09-15 Verfahren zum herstellen von led-körpern mit hilfe einer querschnittverengung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE10393816T Expired - Lifetime DE10393816D2 (en) 2002-09-16 2003-09-15 Verfahren zum herstellen von led-körpern mit hilfe einer querschnittverengung

Country Status (5)

Country Link
US (1) US7241637B2 (de)
CN (1) CN1682382A (de)
AU (1) AU2003269827A1 (de)
DE (2) DE10242947B8 (de)
WO (1) WO2004027883A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10159522A1 (de) * 2001-12-05 2003-06-26 G L I Global Light Ind Gmbh Verfahren zur Herstellung von LED-Körpern
US20030214070A1 (en) * 2002-05-08 2003-11-20 General Electric Company Multiwall polycarbonate sheet and method for its production
TW200635085A (en) * 2005-01-20 2006-10-01 Barnes Group Inc LED assembly having overmolded lens on treated leadframe and method therefor
CN108135754B (zh) * 2015-10-29 2021-03-09 科腾聚合物美国有限责任公司 用于低温应用的热熔弹性附件粘合剂

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0290697A2 (de) * 1987-05-12 1988-11-17 Shen-Yuan Chen Lichtemittierende Diode, Lampe und schnelles Herstellungsverfahren
JPH04329680A (ja) * 1991-05-01 1992-11-18 Sharp Corp 発光装置
JPH10159522A (ja) * 1996-11-28 1998-06-16 Takashi Hikita 可変バルブタイミング・リフト機構
DE19833245A1 (de) * 1997-07-30 1999-02-04 Rohm Co Ltd Halbleiter-Lichtemissionseinrichtung

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6469019A (en) * 1987-09-10 1989-03-15 Nissei Plastics Ind Co Method of sealing light-emitting diode with resin
JPS6469020A (en) 1987-09-10 1989-03-15 Nissei Plastics Ind Co Method of sealing light-emitting diode with resin
JPH06216412A (ja) 1993-01-20 1994-08-05 Stanley Electric Co Ltd Ｌｅｄの製造方法
JP2927660B2 (ja) * 1993-01-25 1999-07-28 シャープ株式会社 樹脂封止型半導体装置の製造方法
JP3193194B2 (ja) 1993-07-09 2001-07-30 三菱電線工業株式会社 基板に実装されたｌｅｄチップにレンズ被覆層をモールドする方法およびそのモールド用基板構造
US5964030A (en) * 1994-06-10 1999-10-12 Vlsi Technology, Inc. Mold flow regulating dam ring
KR0151828B1 (ko) * 1995-07-25 1998-12-01 김광호 패키지 성형장치
DE19604492C1 (de) 1996-02-08 1997-06-12 Wustlich Hans Dieter Spritzgießwerkzeug zur Herstellung von Leuchtdioden
JPH11121488A (ja) * 1997-10-15 1999-04-30 Toshiba Corp 半導体装置の製造方法及び樹脂封止装置
EP1075022A1 (de) * 1999-08-04 2001-02-07 STMicroelectronics S.r.l. Giessform mit versetzten Rändern zur Kunststoffeinkapselung von integrierten Halbleiteranordnungen
DE10159522A1 (de) * 2001-12-05 2003-06-26 G L I Global Light Ind Gmbh Verfahren zur Herstellung von LED-Körpern
DE10163116B4 (de) * 2001-12-24 2008-04-10 G.L.I. Global Light Industries Gmbh Verfahren zum Herstellen von lichtleitenden LED-Körpern in zwei räumlich und zeitlich getrennten Stufen

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0290697A2 (de) * 1987-05-12 1988-11-17 Shen-Yuan Chen Lichtemittierende Diode, Lampe und schnelles Herstellungsverfahren
JPH04329680A (ja) * 1991-05-01 1992-11-18 Sharp Corp 発光装置
JPH10159522A (ja) * 1996-11-28 1998-06-16 Takashi Hikita 可変バルブタイミング・リフト機構
DE19833245A1 (de) * 1997-07-30 1999-02-04 Rohm Co Ltd Halbleiter-Lichtemissionseinrichtung

Also Published As

Publication number Publication date
WO2004027883A1 (de) 2004-04-01
DE10242947A1 (de) 2004-03-25
US7241637B2 (en) 2007-07-10
DE10242947B4 (de) 2008-12-18
DE10393816D2 (en) 2005-08-25
US20060051901A1 (en) 2006-03-09
AU2003269827A1 (en) 2004-04-08
CN1682382A (zh) 2005-10-12

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8143 Lapsed due to claiming internal priority
8170 Reinstatement of the former position
8327 Change in the person/name/address of the patent owner

Owner name: ODELO LED GMBH, 47475 KAMP-LINTFORT, DE

8364 No opposition during term of opposition
8396 Reprint of erroneous front page
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20150401