JPH0464458B2 - - Google Patents

Info

Publication number
JPH0464458B2
JPH0464458B2 JP59252319A JP25231984A JPH0464458B2 JP H0464458 B2 JPH0464458 B2 JP H0464458B2 JP 59252319 A JP59252319 A JP 59252319A JP 25231984 A JP25231984 A JP 25231984A JP H0464458 B2 JPH0464458 B2 JP H0464458B2
Authority
JP
Japan
Prior art keywords
field plate
region
plate electrode
semiconductor layer
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59252319A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61129867A (ja
Inventor
Koji Shirai
Takeshi Kawamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP59252319A priority Critical patent/JPS61129867A/ja
Priority to KR1019850008747A priority patent/KR890004495B1/ko
Priority to US06/802,372 priority patent/US4707720A/en
Priority to EP85115145A priority patent/EP0190423B1/en
Priority to DE8585115145T priority patent/DE3585225D1/de
Publication of JPS61129867A publication Critical patent/JPS61129867A/ja
Publication of JPH0464458B2 publication Critical patent/JPH0464458B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/111Field plates
    • H10D64/112Field plates comprising multiple field plate segments
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411Insulated-gate bipolar transistors [IGBT]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66Vertical DMOS [VDMOS] FETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66Vertical DMOS [VDMOS] FETs
    • H10D30/663Vertical DMOS [VDMOS] FETs having both source contacts and drain contacts on the same surface, i.e. up-drain VDMOS
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/101Integrated devices comprising main components and built-in components, e.g. IGBT having built-in freewheel diode
    • H10D84/121BJTs having built-in components
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/149Source or drain regions of field-effect devices
    • H10D62/151Source or drain regions of field-effect devices of IGFETs 

Landscapes

  • Bipolar Transistors (AREA)
JP59252319A 1984-11-29 1984-11-29 半導体装置 Granted JPS61129867A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP59252319A JPS61129867A (ja) 1984-11-29 1984-11-29 半導体装置
KR1019850008747A KR890004495B1 (ko) 1984-11-29 1985-11-22 반도체 장치
US06/802,372 US4707720A (en) 1984-11-29 1985-11-27 Semiconductor memory device
EP85115145A EP0190423B1 (en) 1984-11-29 1985-11-29 Planar semiconductor device having a field plate electrode
DE8585115145T DE3585225D1 (de) 1984-11-29 1985-11-29 Planare halbleitervorrichtung mit einer feldplatte.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59252319A JPS61129867A (ja) 1984-11-29 1984-11-29 半導体装置

Publications (2)

Publication Number Publication Date
JPS61129867A JPS61129867A (ja) 1986-06-17
JPH0464458B2 true JPH0464458B2 (enrdf_load_stackoverflow) 1992-10-15

Family

ID=17235598

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59252319A Granted JPS61129867A (ja) 1984-11-29 1984-11-29 半導体装置

Country Status (1)

Country Link
JP (1) JPS61129867A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2956434B2 (ja) * 1992-10-30 1999-10-04 株式会社デンソー 絶縁分離形半導体装置
JP2803565B2 (ja) * 1994-04-15 1998-09-24 株式会社デンソー 半導体装置の製造方法
CN103681808A (zh) * 2012-09-09 2014-03-26 苏州英能电子科技有限公司 含场板结构的横向双极型晶体管

Also Published As

Publication number Publication date
JPS61129867A (ja) 1986-06-17

Similar Documents

Publication Publication Date Title
US4399449A (en) Composite metal and polysilicon field plate structure for high voltage semiconductor devices
EP0129362A2 (en) Schottky barrier diode with guard ring
EP0663698B1 (en) Semiconductor device and its manufacture
US4375717A (en) Process for producing a field-effect transistor
JP4607266B2 (ja) 半絶縁ポリシリコン(sipos)を用いた電力半導体装置及びその製造方法
KR890004495B1 (ko) 반도체 장치
US5202573A (en) Dual anode mos scr with anti crosstalk collecting region
JP3468571B2 (ja) 半導体装置
JPH0464458B2 (enrdf_load_stackoverflow)
US6040219A (en) Method of fabricating power semiconductor device using semi-insulating polycrystalline silicon (SIPOS) film
JPH10294475A (ja) 半導体装置とその製造方法
JP2753011B2 (ja) 高耐圧プレーナ型半導体素子およびその製造方法
JPS6048111B2 (ja) 不揮発性半導体記憶装置
JPH0344412B2 (enrdf_load_stackoverflow)
KR100289742B1 (ko) 반절연폴리실리콘막을이용한전력반도체장치
JP3869581B2 (ja) 半導体装置およびその製法
JP2904545B2 (ja) 高耐圧プレーナ型半導体素子およびその製造方法
JPH07130898A (ja) 半導体装置およびその製造方法
JP2003163351A (ja) 絶縁ゲート型半導体装置およびその製造方法
JP2982510B2 (ja) 半導体装置及びその製造方法
KR19990010738A (ko) 전력용 반도체소자 및 그 제조방법
JP2692292B2 (ja) 集積回路装置用縦形バイポーラトランジスタ
JP2682231B2 (ja) 半導体装置
JPH02161767A (ja) 半導体装置の製造方法
JPH0883918A (ja) 半導体装置