JPH046431B2 - - Google Patents

Info

Publication number
JPH046431B2
JPH046431B2 JP59234321A JP23432184A JPH046431B2 JP H046431 B2 JPH046431 B2 JP H046431B2 JP 59234321 A JP59234321 A JP 59234321A JP 23432184 A JP23432184 A JP 23432184A JP H046431 B2 JPH046431 B2 JP H046431B2
Authority
JP
Japan
Prior art keywords
polyimide
metal foil
composite film
film
foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59234321A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61111181A (ja
Inventor
Masanori Imai
Ken Noda
Toshio Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP59234321A priority Critical patent/JPS61111181A/ja
Publication of JPS61111181A publication Critical patent/JPS61111181A/ja
Publication of JPH046431B2 publication Critical patent/JPH046431B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Wire Bonding (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP59234321A 1984-11-07 1984-11-07 ポリイミド−金属箔複合フイルムの製法 Granted JPS61111181A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59234321A JPS61111181A (ja) 1984-11-07 1984-11-07 ポリイミド−金属箔複合フイルムの製法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59234321A JPS61111181A (ja) 1984-11-07 1984-11-07 ポリイミド−金属箔複合フイルムの製法

Publications (2)

Publication Number Publication Date
JPS61111181A JPS61111181A (ja) 1986-05-29
JPH046431B2 true JPH046431B2 (enExample) 1992-02-05

Family

ID=16969174

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59234321A Granted JPS61111181A (ja) 1984-11-07 1984-11-07 ポリイミド−金属箔複合フイルムの製法

Country Status (1)

Country Link
JP (1) JPS61111181A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0793495B2 (ja) * 1991-11-18 1995-10-09 株式会社麗光 フレキシブル導電体の製造法
US6998455B1 (en) 1999-10-21 2006-02-14 Nippon Steel Chemical Co., Ltd. Laminate and process for producing the same
TWI300744B (enExample) 2001-04-19 2008-09-11 Nippon Steel Chemical Co
JP5110242B2 (ja) * 2004-12-03 2012-12-26 宇部興産株式会社 ポリイミド、ポリイミドフィルム及び積層体
JP4957059B2 (ja) * 2005-04-19 2012-06-20 宇部興産株式会社 ポリイミドフィルム積層体
CN101175633B (zh) 2005-04-19 2011-12-21 宇部兴产株式会社 聚酰亚胺薄膜层合体
JP6445965B2 (ja) * 2013-02-19 2018-12-26 日鉄ケミカル＆マテリアル株式会社 積層体、太陽電池用部材、太陽電池、表示装置用部材、表示装置及び積層体の製造方法

Also Published As

Publication number Publication date
JPS61111181A (ja) 1986-05-29

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