JPH0463152U - - Google Patents
Info
- Publication number
- JPH0463152U JPH0463152U JP1990105170U JP10517090U JPH0463152U JP H0463152 U JPH0463152 U JP H0463152U JP 1990105170 U JP1990105170 U JP 1990105170U JP 10517090 U JP10517090 U JP 10517090U JP H0463152 U JPH0463152 U JP H0463152U
- Authority
- JP
- Japan
- Prior art keywords
- area
- plating
- lead
- nickel plating
- striped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- 238000007747 plating Methods 0.000 claims description 13
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａは本考案の一実施例を示す断面図、第
１図ｂはその一部を示す平面図、第２図は第１図
の実施例のストライプめつき条から製造したリー
ドフレームをパワートランジスタに実装した例を
示す断面図、第３図は他の実施例のストライプめ
つき条から製造したリードフレームをパワートラ
ンジスタに実装した例を示す断面図、第４図はパ
ワートランジスタの外観の一例を示す正面図、第
５図及び第６図は従来のストライプめつき条を示
す断面図である。
符号の説明、４０……ストライプめつき条、４
１……異形銅条、４２……ニツケルめつき、４２
ａ……リード部ニツケルめつき、４３……肉厚部
、４４……銀めつき、４５……肉薄部、４５ａ…
…リード部先端部、４６，４６ａ，４６ｂ……無
めつき部、５０……モールドレジン、５１……シ
リコンチツプ、５２……ヒートシンク部、５３…
…ボンデイングワイヤ、５４……リード部、５５
……モールドレジン境界部。
FIG. 1a is a cross-sectional view showing one embodiment of the present invention, FIG. 1b is a plan view showing a part of the same, and FIG. 2 is a lead frame manufactured from the striped plating strip of the embodiment of FIG. FIG. 3 is a cross-sectional view showing an example in which a lead frame manufactured from striped plating strips of another embodiment is mounted in a power transistor, and FIG. 4 is a cross-sectional view showing an example of the appearance of the power transistor. A front view showing an example, and FIGS. 5 and 6 are cross-sectional views showing conventional striped plating strips. Explanation of code, 40...Striped plating line, 4
1... Unusual copper strip, 42... Nickel plating, 42
a...lead part nickel plating, 43...thick part, 44...silver plating, 45...thin part, 45a...
...Lead part tip, 46, 46a, 46b...Unplated part, 50...Mold resin, 51...Silicon chip, 52...Heat sink part, 53...
...Bonding wire, 54...Lead part, 55
...Mold resin boundary.
Claims (1)
部の領域にニツケルめつきを施して成るリードフ
レーム用ストライプめつき条において、 半導体素子を封止するモールドレジン内に位置
する部分の一部をニツケルめつきを施さない領域
とし、モールドレジン内から外部に露出してリー
ド部となる境界部分からリード部の限定された一
部にかけてニツケルめつきを施す領域とし、その
他のリード部をニツケルめつきを施さない領域と
したことを特徴とするリードフレーム用ストライ
プめつき条。[Claims for Utility Model Registration] A striped plating strip for a lead frame, which is made of copper or copper alloy as a base and is plated with nickel on at least a part of the surface, in a mold resin for sealing a semiconductor element. A part of the position is an area where nickel plating is not applied, and a limited area of the lead part is an area where nickel plating is applied from the boundary part that is exposed to the outside from inside the mold resin and becomes the lead part, and the other part is an area where nickel plating is applied. A striped plating strip for a lead frame, characterized in that the lead portion is an area where no nickel plating is applied.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990105170U JPH0463152U (en) | 1990-10-05 | 1990-10-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990105170U JPH0463152U (en) | 1990-10-05 | 1990-10-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0463152U true JPH0463152U (en) | 1992-05-29 |
Family
ID=31850763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990105170U Pending JPH0463152U (en) | 1990-10-05 | 1990-10-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0463152U (en) |
-
1990
- 1990-10-05 JP JP1990105170U patent/JPH0463152U/ja active Pending
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