JPH0463039B2 - - Google Patents

Info

Publication number
JPH0463039B2
JPH0463039B2 JP59213188A JP21318884A JPH0463039B2 JP H0463039 B2 JPH0463039 B2 JP H0463039B2 JP 59213188 A JP59213188 A JP 59213188A JP 21318884 A JP21318884 A JP 21318884A JP H0463039 B2 JPH0463039 B2 JP H0463039B2
Authority
JP
Japan
Prior art keywords
gallium arsenide
gallium
phosphide
gaas
superlattice
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59213188A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6191098A (ja
Inventor
Masayoshi Umeno
Shiro Sakai
Tetsuo Soga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daido Steel Co Ltd
Original Assignee
Daido Steel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daido Steel Co Ltd filed Critical Daido Steel Co Ltd
Priority to JP59213188A priority Critical patent/JPS6191098A/ja
Priority to US06/780,910 priority patent/US4789421A/en
Priority to CA000491985A priority patent/CA1265980A/en
Priority to DE8585112542T priority patent/DE3581353D1/de
Priority to EP85112542A priority patent/EP0177903B1/en
Publication of JPS6191098A publication Critical patent/JPS6191098A/ja
Publication of JPH0463039B2 publication Critical patent/JPH0463039B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/82—Heterojunctions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02373—Group 14 semiconducting materials
    • H01L21/02381—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02436—Intermediate layers between substrates and deposited layers
    • H01L21/02439—Materials
    • H01L21/02441—Group 14 semiconducting materials
    • H01L21/0245—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02436—Intermediate layers between substrates and deposited layers
    • H01L21/02439—Materials
    • H01L21/02455—Group 13/15 materials
    • H01L21/02461—Phosphides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02436—Intermediate layers between substrates and deposited layers
    • H01L21/02439—Materials
    • H01L21/02455—Group 13/15 materials
    • H01L21/02463—Arsenides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02436—Intermediate layers between substrates and deposited layers
    • H01L21/02494—Structure
    • H01L21/02496—Layer structure
    • H01L21/02505—Layer structure consisting of more than two layers
    • H01L21/02507—Alternating layers, e.g. superlattice
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02538—Group 13/15 materials
    • H01L21/02546—Arsenides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/149—Silicon on III-V

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Recrystallisation Techniques (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
JP59213188A 1984-10-09 1984-10-09 シリコン基板上における砒素化ガリウム成長結晶体とその結晶成長方法 Granted JPS6191098A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP59213188A JPS6191098A (ja) 1984-10-09 1984-10-09 シリコン基板上における砒素化ガリウム成長結晶体とその結晶成長方法
US06/780,910 US4789421A (en) 1984-10-09 1985-09-27 Gallium arsenide superlattice crystal grown on silicon substrate and method of growing such crystal
CA000491985A CA1265980A (en) 1984-10-09 1985-10-01 Gallium arsenide crystal grown on silicon substrate and method of growing such crystal
DE8585112542T DE3581353D1 (de) 1984-10-09 1985-10-03 Halbleiteranordnung mit monokristalliner schicht aus ga-as auf einem substrat aus silicium und verfahren zu deren herstellung.
EP85112542A EP0177903B1 (en) 1984-10-09 1985-10-03 Semiconductor device having a gallium arsenide crystal layer grown on a silicon substrate and method for producing it

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59213188A JPS6191098A (ja) 1984-10-09 1984-10-09 シリコン基板上における砒素化ガリウム成長結晶体とその結晶成長方法

Publications (2)

Publication Number Publication Date
JPS6191098A JPS6191098A (ja) 1986-05-09
JPH0463039B2 true JPH0463039B2 (enExample) 1992-10-08

Family

ID=16634992

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59213188A Granted JPS6191098A (ja) 1984-10-09 1984-10-09 シリコン基板上における砒素化ガリウム成長結晶体とその結晶成長方法

Country Status (5)

Country Link
US (1) US4789421A (enExample)
EP (1) EP0177903B1 (enExample)
JP (1) JPS6191098A (enExample)
CA (1) CA1265980A (enExample)
DE (1) DE3581353D1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0214610B1 (en) * 1985-09-03 1990-12-05 Daido Tokushuko Kabushiki Kaisha Epitaxial gallium arsenide semiconductor wafer and method of producing the same
US5578521A (en) * 1986-11-20 1996-11-26 Nippondenso Co., Ltd. Semiconductor device with vaporphase grown epitaxial
FR2620863B1 (fr) * 1987-09-22 1989-12-01 Thomson Csf Dispositif optoelectronique a base de composes iii-v sur substrat silicium
JPH01107515A (ja) * 1987-10-20 1989-04-25 Daido Steel Co Ltd 半導体素子の製造方法
JP2649936B2 (ja) * 1988-03-01 1997-09-03 富士通株式会社 歪超格子バッファ
US5194395A (en) * 1988-07-28 1993-03-16 Fujitsu Limited Method of producing a substrate having semiconductor-on-insulator structure with gettering sites
JPH0237771A (ja) * 1988-07-28 1990-02-07 Fujitsu Ltd Ｓｏｉ基板
JPH0294663A (ja) * 1988-09-30 1990-04-05 Mitsubishi Electric Corp 半導体装置およびその製造方法
US5198269A (en) * 1989-04-24 1993-03-30 Battelle Memorial Institute Process for making sol-gel deposited ferroelectric thin films insensitive to their substrates
JP2557546B2 (ja) * 1990-03-30 1996-11-27 三菱電機株式会社 半導体装置の製造方法
JP3111644B2 (ja) * 1992-06-09 2000-11-27 三菱化学株式会社 りん化ひ化ガリウムエピタキシャルウエハ
US5993981A (en) * 1997-04-18 1999-11-30 Raytheon Company Broadband protective optical window coating
US20070252216A1 (en) * 2006-04-28 2007-11-01 Infineon Technologies Ag Semiconductor device and a method of manufacturing such a semiconductor device
NO20093193A1 (no) * 2009-10-22 2011-04-26 Integrated Solar As Fremgangsmate for fremstilling av fotoelektriske solceller og en multifunksjonell solcelle

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2225207B1 (enExample) * 1973-04-16 1978-04-21 Ibm
US4066481A (en) * 1974-11-11 1978-01-03 Rockwell International Corporation Metalorganic chemical vapor deposition of IVA-IVA compounds and composite
US4517047A (en) * 1981-01-23 1985-05-14 The United States Of America As Represented By The Secretary Of The Army MBE growth technique for matching superlattices grown on GaAs substrates
US4578127A (en) * 1982-08-13 1986-03-25 At&T Bell Laboratories Method of making an improved group III-V semiconductor device utilizing a getter-smoothing layer
JPS6012724A (ja) * 1983-07-01 1985-01-23 Agency Of Ind Science & Technol 化合物半導体の成長方法
US4588451A (en) * 1984-04-27 1986-05-13 Advanced Energy Fund Limited Partnership Metal organic chemical vapor deposition of 111-v compounds on silicon

Also Published As

Publication number Publication date
DE3581353D1 (de) 1991-02-21
EP0177903A3 (en) 1987-09-09
EP0177903B1 (en) 1991-01-16
CA1265980A (en) 1990-02-20
US4789421A (en) 1988-12-06
JPS6191098A (ja) 1986-05-09
EP0177903A2 (en) 1986-04-16

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