JPH046056Y2 - - Google Patents
Info
- Publication number
- JPH046056Y2 JPH046056Y2 JP1986197092U JP19709286U JPH046056Y2 JP H046056 Y2 JPH046056 Y2 JP H046056Y2 JP 1986197092 U JP1986197092 U JP 1986197092U JP 19709286 U JP19709286 U JP 19709286U JP H046056 Y2 JPH046056 Y2 JP H046056Y2
- Authority
- JP
- Japan
- Prior art keywords
- led
- led chip
- lead terminal
- metal core
- wiring patterns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 229920005989 resin Polymers 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 description 23
- 239000003822 epoxy resin Substances 0.000 description 8
- 238000005192 partition Methods 0.000 description 8
- 239000004033 plastic Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 7
- 239000004744 fabric Substances 0.000 description 6
- 235000014443 Pyrus communis Nutrition 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 238000005219 brazing Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986197092U JPH046056Y2 (zh) | 1986-12-22 | 1986-12-22 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986197092U JPH046056Y2 (zh) | 1986-12-22 | 1986-12-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63101987U JPS63101987U (zh) | 1988-07-02 |
JPH046056Y2 true JPH046056Y2 (zh) | 1992-02-19 |
Family
ID=31156504
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986197092U Expired JPH046056Y2 (zh) | 1986-12-22 | 1986-12-22 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH046056Y2 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3966845B2 (ja) * | 2003-09-29 | 2007-08-29 | 株式会社松村電機製作所 | Led照明装置 |
US20080074884A1 (en) * | 2006-09-25 | 2008-03-27 | Thye Linn Mok | Compact high-intensty LED-based light source and method for making the same |
JP5629630B2 (ja) * | 2011-04-08 | 2014-11-26 | スタンレー電気株式会社 | 光半導体装置 |
JP2015023220A (ja) * | 2013-07-22 | 2015-02-02 | ローム株式会社 | 表示装置 |
JP5987804B2 (ja) * | 2013-09-10 | 2016-09-07 | ウシオ電機株式会社 | 発光モジュール装置 |
TW201947786A (zh) * | 2018-05-10 | 2019-12-16 | 聯京光電股份有限公司 | 光電封裝體 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5079293A (zh) * | 1973-11-12 | 1975-06-27 | ||
JPS5570080A (en) * | 1978-11-21 | 1980-05-27 | Nec Corp | Preparation of luminous display device |
JPS55132083A (en) * | 1979-03-30 | 1980-10-14 | Sanyo Electric Co Ltd | Light emitting diode substrate |
JPS5922488B2 (ja) * | 1981-04-16 | 1984-05-26 | 吉恭 河田 | 藁八手 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS603587Y2 (ja) * | 1979-04-24 | 1985-01-31 | 三洋電機株式会社 | 発光ダイオ−ド基板 |
JPS5922488U (ja) * | 1982-08-03 | 1984-02-10 | 株式会社東芝 | 発光表示装置用基板 |
JPS59171358U (ja) * | 1983-04-28 | 1984-11-16 | 三洋電機株式会社 | 発光ダイオ−ド表示器 |
-
1986
- 1986-12-22 JP JP1986197092U patent/JPH046056Y2/ja not_active Expired
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5079293A (zh) * | 1973-11-12 | 1975-06-27 | ||
JPS5570080A (en) * | 1978-11-21 | 1980-05-27 | Nec Corp | Preparation of luminous display device |
JPS55132083A (en) * | 1979-03-30 | 1980-10-14 | Sanyo Electric Co Ltd | Light emitting diode substrate |
JPS5922488B2 (ja) * | 1981-04-16 | 1984-05-26 | 吉恭 河田 | 藁八手 |
Also Published As
Publication number | Publication date |
---|---|
JPS63101987U (zh) | 1988-07-02 |
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