JPH0460345B2 - - Google Patents
Info
- Publication number
- JPH0460345B2 JPH0460345B2 JP59064484A JP6448484A JPH0460345B2 JP H0460345 B2 JPH0460345 B2 JP H0460345B2 JP 59064484 A JP59064484 A JP 59064484A JP 6448484 A JP6448484 A JP 6448484A JP H0460345 B2 JPH0460345 B2 JP H0460345B2
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- wire
- bonding
- core
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W72/50—
-
- H10W72/522—
-
- H10W72/523—
-
- H10W72/552—
-
- H10W72/5525—
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- H10W72/555—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59064484A JPS60207357A (ja) | 1984-03-31 | 1984-03-31 | 半導体用ボンディング細線 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59064484A JPS60207357A (ja) | 1984-03-31 | 1984-03-31 | 半導体用ボンディング細線 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60207357A JPS60207357A (ja) | 1985-10-18 |
| JPH0460345B2 true JPH0460345B2 (enExample) | 1992-09-25 |
Family
ID=13259535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59064484A Granted JPS60207357A (ja) | 1984-03-31 | 1984-03-31 | 半導体用ボンディング細線 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60207357A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103943584A (zh) * | 2013-01-18 | 2014-07-23 | 日月光半导体制造股份有限公司 | 用于半导体装置的焊线 |
-
1984
- 1984-03-31 JP JP59064484A patent/JPS60207357A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60207357A (ja) | 1985-10-18 |
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