JPH0460345B2 - - Google Patents

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Publication number
JPH0460345B2
JPH0460345B2 JP59064484A JP6448484A JPH0460345B2 JP H0460345 B2 JPH0460345 B2 JP H0460345B2 JP 59064484 A JP59064484 A JP 59064484A JP 6448484 A JP6448484 A JP 6448484A JP H0460345 B2 JPH0460345 B2 JP H0460345B2
Authority
JP
Japan
Prior art keywords
alloy
wire
bonding
core
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59064484A
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English (en)
Other versions
JPS60207357A (ja
Inventor
Shoji Shiga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP59064484A priority Critical patent/JPS60207357A/ja
Publication of JPS60207357A publication Critical patent/JPS60207357A/ja
Publication of JPH0460345B2 publication Critical patent/JPH0460345B2/ja
Granted legal-status Critical Current

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    • H—ELECTRICITY
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
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    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
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    • H01L2224/45601—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of less than 400°C
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    • H01L2224/45601—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of less than 400°C
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】
本発明は半導体用ボンデイング細線の改良に関
するものである。 従来IC，LSI或はハイブリツドICなどの半導体
において、Siチツプなどの半導体素子上に形成さ
れた電極をリードフレームや基板リードとの間の
電気接続を行う目的で15〜60μφ程度のAu細線や
Al−Si合金細線が使用されている。前者の細線
は熱融着超音波ボンデイング法などにより高生産
性でボンデイングを行うことが出来且つ耐食性を
有するため広く利用されているが、その欠点は著
しく高価なことである。又一方後者の細線はAu
線に比して安価であるが、大気雰囲気中において
熱融着法などのボンデイング方法を適用すること
が出来ず生産性に劣ると共に腐食し易く半導体使
用時の断線等の故障をまねき易い。特にエポキシ
樹脂等の汎用樹脂モールド半導体においては該樹
脂の透湿性と塩素汚染によつてAl線の腐食は大
きな問題となつていた。 このAl合金線に代えてCu又はCu合金線を使用
する試みもあるが、細線の腐食問題においてAl
合金線より稍改良されるが、実用的には大きなネ
ツクとなるものであつた。更にこの合金線にAg
を被覆したものを利用する試みもあるが、樹脂モ
ールド半導体などにおいて激しいマイグレーシヨ
ンをおこして回路短絡の障害となるものであつ
た。 なお前記のCu又はCu合金線においてもマイグ
レーシヨンをおこすがこのAg線より低いもので
ある。 本発明はかかる現状に鑑み鋭意研究を行つた結
果、経済性に優れ且つ高性能を有する実用的なボ
ンデイング細線を見出したものである。即ち本発
明はCu又はCu合金の心線の外周に直接又は中間
層を介してIn，Zn，Cd又はこれらの合金の内か
ら選ばれた１種の被覆層の設けたことを特徴とす
るものである。 本発明における心線のCu合金としては例えば
Cu−Sn，Cu−Fe，Cu−Ag，Cu−Zr，Cu−Zn
等であり、又被覆層の合金としては例えばSn−
Zn，Zn−Cd，Sn−In，Zn−Cd−Cu，Zn−Cu，
In−Cd等である。 この被覆層の厚さについては特に限定するもの
ではないが通常0.03〜5μ程度が好ましい。その理
由は0.03μ未満の場合には本発明の効果を発揮す
ることができずCu又はCu合金の心線のみとほぼ
同様となるものであり、又5μを越えると経済的
に高くなると共にボンデイング部の脆化をまねく
ことになる。即ちこの被覆層を形成せる金属又は
合金は何れもCuより電気化学的に単子金属であ
るため、Cuと加熱合金化するとCuの耐食性を阻
害することなく機械的強度を向上することができ
るため、ボンデイング細線として使用した場合次
の如き半導体用ボンデイングとして優れた効果を
もたらすものである。 (1) 被覆層が特性陽極的に作用するため、たとえ
塩分や水分にさらされても心線が腐食すること
なく従つて断線の事故を生じない。 (2) 表面がマイグレーシヨンをおこさない金属で
被覆されているため短絡をおこす危険がない。 (3) 熱融着ボンデイングにおいて、ボンデイング
により合金化して機械的強度が向上するためボ
ンデイング強化を図ることが出来る。 (4) 転位の上昇を抑止しうる被覆層の効果により
細線自身の機械的強度が向上し、合金化しなく
ても上記(3)の効果と相俟つて高導電性にして安
価な純鋼を心線として利用することができる。 又本発明は心線と被覆層との間に中間層を設け
てもよく、中間層として例えばNi，Co又はNi−
Co，Ni−Ｐ，Co−Ｂ，Ni−Fe，Ni−Znなどの
合金を介在させるものである。この厚さについて
も特に限定するものではなく望ましくは0.01〜
0.5μが好ましい。その理由はこの中間層を設ける
ことにより上記(1)〜(4)の効果を更に向上せしめる
と共に心線と被覆層との反応を抑止せしめて導電
率を安定に保持することができる。従つてその厚
さが0.01μ未満の場合にはその効果を発揮するこ
とが出来ず、又0.5μをこえてもそれ程効果に期待
出来ないためである。 又本発明ボンデイング線は雰囲気超音波熱圧着
法や超音波圧着法によりボンデイングすることが
出来る。 又被覆層はCu又はCu合金の心線に真空メツキ、
ホツトデイツプ、機械的接合等により被覆できる
が、電気メツキ法により製造することが最も有利
である。 次に本発明の実施例について説明する。 実施例 無酸素銅線（20μφ）とSn入銅線（Cu−0.15Sn
−0.005P，20μφ）との表面に第１表に示すメツ
キを施して本発明ボンデイング細線及び比較例ボ
ンデイング細線をえた。 これらの細線を用いてSiチツプをダイボンデイ
ングした。即ち16ピンのリードフレーム（Cu−
0.15Sn−0.01P）に雰囲気超音波熱圧着法により
ワイヤーボンドを行つた。ボンデイングの条件は
雰囲気10％H2−N2、リードフレーム温度195℃、
ボンデイング圧50ｇ（第１ボンデイング）と90ｇ
ｒ（第２ボンデイング）にて行つた。 ボンデイングした後プルテスターにてボンデイ
ング強度を測定し、又ボンデイングしたリードフ
レームをエポキシ樹脂にてモードとしてICを作
製し、130℃にてプレツシロークツカーに
2000Hr、12V印加で保持した後電気測定して断
線及び短絡の確率を測定した。その結果は第１表
に併記した通りである。
【表】
【表】 上記より明らかの如く本発明によるボンデイン
グ細線はAu線と同様に断線及び短絡することな
く、且つ優れた強度を有することが認められた。
又Cu線では短絡が観測されなかつたが、ICを破
壊して電子顕微鏡にて測定したところCuのマイ
グレーシヨンが見られた。しかし本発明細線では
このような現象は全く痕跡が見られなかつた。 以上詳述した如く本発明半導体用ボンデイング
細線によれば高価なAu線に代つて安価にしてし
かも高性能を有する等工業的に極めて有用なもの
である。

Claims (1)

  1. 【特許請求の範囲】 １ Cu又はCu合金の心線の外周に直接又は中間
    層を介してIn，Zn，Cd，又はこれらの合金の内
    から選ばれた１種の被覆層を設けたことを特徴と
    する半導体用ボンデイング細線。 ２ 中間層としてNi，Co又はこれらの合金から
    なることを特徴とする特許請求の範囲第１項記載
    の半導体用ボンデイング細線。 ３ 被覆層の厚さを0.03〜5μにしたことを特徴と
    する特許請求の範囲第１項記載の半導体用ボンデ
    イング細線。
JP59064484A 1984-03-31 1984-03-31 半導体用ボンディング細線 Granted JPS60207357A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59064484A JPS60207357A (ja) 1984-03-31 1984-03-31 半導体用ボンディング細線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59064484A JPS60207357A (ja) 1984-03-31 1984-03-31 半導体用ボンディング細線

Publications (2)

Publication Number Publication Date
JPS60207357A JPS60207357A (ja) 1985-10-18
JPH0460345B2 true JPH0460345B2 (ja) 1992-09-25

Family

ID=13259535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59064484A Granted JPS60207357A (ja) 1984-03-31 1984-03-31 半導体用ボンディング細線

Country Status (1)

Country Link
JP (1) JPS60207357A (ja)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103943584A (zh) * 2013-01-18 2014-07-23 日月光半导体制造股份有限公司 用于半导体装置的焊线

Also Published As

Publication number Publication date
JPS60207357A (ja) 1985-10-18

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