JPS60207357A - 半導体用ボンディング細線 - Google Patents

半導体用ボンディング細線

Info

Publication number
JPS60207357A
JPS60207357A JP59064484A JP6448484A JPS60207357A JP S60207357 A JPS60207357 A JP S60207357A JP 59064484 A JP59064484 A JP 59064484A JP 6448484 A JP6448484 A JP 6448484A JP S60207357 A JPS60207357 A JP S60207357A
Authority
JP
Japan
Prior art keywords
wire
bonding
alloy
thin
coating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59064484A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0460345B2 (enExample
Inventor
Shoji Shiga
志賀　章二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP59064484A priority Critical patent/JPS60207357A/ja
Publication of JPS60207357A publication Critical patent/JPS60207357A/ja
Publication of JPH0460345B2 publication Critical patent/JPH0460345B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H10W72/523—Multilayered bond wires, e.g. having a coating concentric around a core characterised by the structures of the outermost layers, e.g. multilayered coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/555—Materials of bond wires of outermost layers of multilayered bond wires, e.g. material of a coating

Landscapes

  • Wire Bonding (AREA)
JP59064484A 1984-03-31 1984-03-31 半導体用ボンディング細線 Granted JPS60207357A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59064484A JPS60207357A (ja) 1984-03-31 1984-03-31 半導体用ボンディング細線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59064484A JPS60207357A (ja) 1984-03-31 1984-03-31 半導体用ボンディング細線

Publications (2)

Publication Number Publication Date
JPS60207357A true JPS60207357A (ja) 1985-10-18
JPH0460345B2 JPH0460345B2 (enExample) 1992-09-25

Family

ID=13259535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59064484A Granted JPS60207357A (ja) 1984-03-31 1984-03-31 半導体用ボンディング細線

Country Status (1)

Country Link
JP (1) JPS60207357A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103943584A (zh) * 2013-01-18 2014-07-23 日月光半导体制造股份有限公司 用于半导体装置的焊线

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103943584A (zh) * 2013-01-18 2014-07-23 日月光半导体制造股份有限公司 用于半导体装置的焊线

Also Published As

Publication number Publication date
JPH0460345B2 (enExample) 1992-09-25

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