JPH045752B2 - - Google Patents
Info
- Publication number
- JPH045752B2 JPH045752B2 JP21181283A JP21181283A JPH045752B2 JP H045752 B2 JPH045752 B2 JP H045752B2 JP 21181283 A JP21181283 A JP 21181283A JP 21181283 A JP21181283 A JP 21181283A JP H045752 B2 JPH045752 B2 JP H045752B2
- Authority
- JP
- Japan
- Prior art keywords
- ions
- plating bath
- bath
- magnetic
- 4πms
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21181283A JPS60103181A (ja) | 1983-11-11 | 1983-11-11 | 無電解めつき浴 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21181283A JPS60103181A (ja) | 1983-11-11 | 1983-11-11 | 無電解めつき浴 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60103181A JPS60103181A (ja) | 1985-06-07 |
| JPH045752B2 true JPH045752B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-02-03 |
Family
ID=16611998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21181283A Granted JPS60103181A (ja) | 1983-11-11 | 1983-11-11 | 無電解めつき浴 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60103181A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2826441T3 (es) * | 2017-06-02 | 2021-05-18 | Atotech Deutschland Gmbh | Baños de metalizado no electrolítico de aleación de níquel, un método de deposición de aleaciones de níquel, depósitos de aleación de níquel y usos de dichos depósitos de aleación de níquel formados |
-
1983
- 1983-11-11 JP JP21181283A patent/JPS60103181A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60103181A (ja) | 1985-06-07 |