JPH045275B2 - - Google Patents

Info

Publication number
JPH045275B2
JPH045275B2 JP57054991A JP5499182A JPH045275B2 JP H045275 B2 JPH045275 B2 JP H045275B2 JP 57054991 A JP57054991 A JP 57054991A JP 5499182 A JP5499182 A JP 5499182A JP H045275 B2 JPH045275 B2 JP H045275B2
Authority
JP
Japan
Prior art keywords
board
size
module
mark
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57054991A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58171846A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP57054991A priority Critical patent/JPS58171846A/ja
Publication of JPS58171846A publication Critical patent/JPS58171846A/ja
Publication of JPH045275B2 publication Critical patent/JPH045275B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54413—Marks applied to semiconductor devices or parts comprising digital information, e.g. bar codes, data matrix
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP57054991A 1982-04-01 1982-04-01 多数個取りハイブリツドｉｃ基板 Granted JPS58171846A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57054991A JPS58171846A (ja) 1982-04-01 1982-04-01 多数個取りハイブリツドｉｃ基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57054991A JPS58171846A (ja) 1982-04-01 1982-04-01 多数個取りハイブリツドｉｃ基板

Publications (2)

Publication Number Publication Date
JPS58171846A JPS58171846A (ja) 1983-10-08
JPH045275B2 true JPH045275B2 (cg-RX-API-DMAC7.html) 1992-01-30

Family

ID=12986114

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57054991A Granted JPS58171846A (ja) 1982-04-01 1982-04-01 多数個取りハイブリツドｉｃ基板

Country Status (1)

Country Link
JP (1) JPS58171846A (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60153569U (ja) * 1984-03-23 1985-10-12 富士通株式会社 印刷配線基板の認識構造
JPS61212094A (ja) * 1985-03-18 1986-09-20 日立コンデンサ株式会社 印刷配線板の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5635492A (en) * 1979-08-29 1981-04-08 Nippon Electric Co Electronic circuit board
JPS5649158U (cg-RX-API-DMAC7.html) * 1979-09-21 1981-05-01

Also Published As

Publication number Publication date
JPS58171846A (ja) 1983-10-08

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