JPS58171846A - 多数個取りハイブリツドｉｃ基板 - Google Patents

多数個取りハイブリツドｉｃ基板

Info

Publication number
JPS58171846A
JPS58171846A JP57054991A JP5499182A JPS58171846A JP S58171846 A JPS58171846 A JP S58171846A JP 57054991 A JP57054991 A JP 57054991A JP 5499182 A JP5499182 A JP 5499182A JP S58171846 A JPS58171846 A JP S58171846A
Authority
JP
Japan
Prior art keywords
size
board
marks
substrate
thick film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57054991A
Other languages
English (en)
Japanese (ja)
Other versions
JPH045275B2 (cg-RX-API-DMAC7.html
Inventor
Tatsuo Aoi
青井　龍雄
Kazuoki Tanahashi
棚橋　万起
Toshikazu Nishida
西田　利和
Hideaki Hachidan
八段　英明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Tateisi Electronics Co
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tateisi Electronics Co, Omron Tateisi Electronics Co filed Critical Tateisi Electronics Co
Priority to JP57054991A priority Critical patent/JPS58171846A/ja
Publication of JPS58171846A publication Critical patent/JPS58171846A/ja
Publication of JPH045275B2 publication Critical patent/JPH045275B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54413—Marks applied to semiconductor devices or parts comprising digital information, e.g. bar codes, data matrix
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP57054991A 1982-04-01 1982-04-01 多数個取りハイブリツドｉｃ基板 Granted JPS58171846A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57054991A JPS58171846A (ja) 1982-04-01 1982-04-01 多数個取りハイブリツドｉｃ基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57054991A JPS58171846A (ja) 1982-04-01 1982-04-01 多数個取りハイブリツドｉｃ基板

Publications (2)

Publication Number Publication Date
JPS58171846A true JPS58171846A (ja) 1983-10-08
JPH045275B2 JPH045275B2 (cg-RX-API-DMAC7.html) 1992-01-30

Family

ID=12986114

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57054991A Granted JPS58171846A (ja) 1982-04-01 1982-04-01 多数個取りハイブリツドｉｃ基板

Country Status (1)

Country Link
JP (1) JPS58171846A (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60153569U (ja) * 1984-03-23 1985-10-12 富士通株式会社 印刷配線基板の認識構造
JPS61212094A (ja) * 1985-03-18 1986-09-20 日立コンデンサ株式会社 印刷配線板の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5635492A (en) * 1979-08-29 1981-04-08 Nippon Electric Co Electronic circuit board
JPS5649158U (cg-RX-API-DMAC7.html) * 1979-09-21 1981-05-01

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5635492A (en) * 1979-08-29 1981-04-08 Nippon Electric Co Electronic circuit board
JPS5649158U (cg-RX-API-DMAC7.html) * 1979-09-21 1981-05-01

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60153569U (ja) * 1984-03-23 1985-10-12 富士通株式会社 印刷配線基板の認識構造
JPS61212094A (ja) * 1985-03-18 1986-09-20 日立コンデンサ株式会社 印刷配線板の製造方法

Also Published As

Publication number Publication date
JPH045275B2 (cg-RX-API-DMAC7.html) 1992-01-30

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