JPH0452629B2 - - Google Patents

Info

Publication number
JPH0452629B2
JPH0452629B2 JP58153757A JP15375783A JPH0452629B2 JP H0452629 B2 JPH0452629 B2 JP H0452629B2 JP 58153757 A JP58153757 A JP 58153757A JP 15375783 A JP15375783 A JP 15375783A JP H0452629 B2 JPH0452629 B2 JP H0452629B2
Authority
JP
Japan
Prior art keywords
light emitting
conductive pattern
emitting diode
section
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58153757A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6045079A (ja
Inventor
Masaki Saka
Takashi Arai
Takeshi Kawachi
Toshihide Kawamura
Osamu Waki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honda Motor Co Ltd
Original Assignee
Honda Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honda Motor Co Ltd filed Critical Honda Motor Co Ltd
Priority to JP58153757A priority Critical patent/JPS6045079A/ja
Publication of JPS6045079A publication Critical patent/JPS6045079A/ja
Publication of JPH0452629B2 publication Critical patent/JPH0452629B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
JP58153757A 1983-08-23 1983-08-23 発光ダイオ−ドを用いたフレキシブルランプ Granted JPS6045079A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58153757A JPS6045079A (ja) 1983-08-23 1983-08-23 発光ダイオ−ドを用いたフレキシブルランプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58153757A JPS6045079A (ja) 1983-08-23 1983-08-23 発光ダイオ−ドを用いたフレキシブルランプ

Publications (2)

Publication Number Publication Date
JPS6045079A JPS6045079A (ja) 1985-03-11
JPH0452629B2 true JPH0452629B2 (zh) 1992-08-24

Family

ID=15569457

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58153757A Granted JPS6045079A (ja) 1983-08-23 1983-08-23 発光ダイオ−ドを用いたフレキシブルランプ

Country Status (1)

Country Link
JP (1) JPS6045079A (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0432773Y2 (zh) * 1986-10-08 1992-08-06
JPS6486573A (en) * 1987-07-17 1989-03-31 Oshima Denki Co Light emitting device
JPH0192704U (zh) * 1987-12-14 1989-06-19
JPH081964B2 (ja) * 1989-01-18 1996-01-10 株式会社小糸製作所 可撓性を有する表示装置
JP2525038Y2 (ja) * 1989-05-19 1997-02-05 株式会社オムジ 発光ダイオードを用いた患部治療用オムジ
JPH0545812U (ja) * 1991-11-22 1993-06-18 株式会社小糸製作所 車輌用灯具
JPH05185327A (ja) * 1992-01-10 1993-07-27 Think Lab Kk エンボスロールの製作方法
DE19922176C2 (de) * 1999-05-12 2001-11-15 Osram Opto Semiconductors Gmbh Oberflächenmontierte LED-Mehrfachanordnung und deren Verwendung in einer Beleuchtungseinrichtung
JP4519756B2 (ja) * 2005-11-07 2010-08-04 東芝モバイルディスプレイ株式会社 バックライト及びそれを用いた液晶表示装置
DE102006033873A1 (de) * 2006-07-21 2008-01-24 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Strahlungsemittierende Einrichtung mit mehreren strahlungs-emittierenden Bauelementen und Beleuchtungseinrichtung
US20140335635A1 (en) * 2013-05-10 2014-11-13 Osram Sylvania Inc. Electronic assemblies including a subassembly film and methods of producing the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5838180B2 (ja) * 1975-04-26 1983-08-20 フクバコウギヨウ カブシキガイシヤ ジユウタンソウジキノ カイテンブラシソウジソウチ

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6022383Y2 (ja) * 1980-03-04 1985-07-03 三洋電機株式会社 発光ダイオ−ド表示器
JPS5838180U (ja) * 1981-09-08 1983-03-12 株式会社東芝 Ｌｅｄ表示器
JPS58105185U (ja) * 1982-01-08 1983-07-18 クラリオン株式会社 プリント基板等の取付機構

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5838180B2 (ja) * 1975-04-26 1983-08-20 フクバコウギヨウ カブシキガイシヤ ジユウタンソウジキノ カイテンブラシソウジソウチ

Also Published As

Publication number Publication date
JPS6045079A (ja) 1985-03-11

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