JPH0452621B2 - - Google Patents

Info

Publication number
JPH0452621B2
JPH0452621B2 JP60054941A JP5494185A JPH0452621B2 JP H0452621 B2 JPH0452621 B2 JP H0452621B2 JP 60054941 A JP60054941 A JP 60054941A JP 5494185 A JP5494185 A JP 5494185A JP H0452621 B2 JPH0452621 B2 JP H0452621B2
Authority
JP
Japan
Prior art keywords
semiconductor chip
sealing resin
substrate
film carrier
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60054941A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61214443A (ja
Inventor
Yukio Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP60054941A priority Critical patent/JPS61214443A/ja
Publication of JPS61214443A publication Critical patent/JPS61214443A/ja
Publication of JPH0452621B2 publication Critical patent/JPH0452621B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP60054941A 1985-03-19 1985-03-19 半導体装置の製造方法 Granted JPS61214443A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60054941A JPS61214443A (ja) 1985-03-19 1985-03-19 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60054941A JPS61214443A (ja) 1985-03-19 1985-03-19 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS61214443A JPS61214443A (ja) 1986-09-24
JPH0452621B2 true JPH0452621B2 (US06534493-20030318-C00166.png) 1992-08-24

Family

ID=12984664

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60054941A Granted JPS61214443A (ja) 1985-03-19 1985-03-19 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS61214443A (US06534493-20030318-C00166.png)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2581103B2 (ja) * 1987-09-28 1997-02-12 アイシン精機株式会社 チップ部品の導電接合方法
KR940000143B1 (ko) * 1991-06-25 1994-01-07 재단법인 한국전자통신연구소 대형 박막 트랜지스터(TFT) 액정 디스플레이 패널(LCD panel)의 제조방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5365062A (en) * 1976-11-24 1978-06-10 Hitachi Ltd Production of semiconductor and apparatus for the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5365062A (en) * 1976-11-24 1978-06-10 Hitachi Ltd Production of semiconductor and apparatus for the same

Also Published As

Publication number Publication date
JPS61214443A (ja) 1986-09-24

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees