JPH0452613B2 - - Google Patents
Info
- Publication number
- JPH0452613B2 JPH0452613B2 JP58160355A JP16035583A JPH0452613B2 JP H0452613 B2 JPH0452613 B2 JP H0452613B2 JP 58160355 A JP58160355 A JP 58160355A JP 16035583 A JP16035583 A JP 16035583A JP H0452613 B2 JPH0452613 B2 JP H0452613B2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- dry etching
- substrate
- etching method
- synchrotron orbital
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/26—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials
- H10P50/264—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means
- H10P50/266—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means by vapour etching only
- H10P50/267—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means by vapour etching only using plasmas
Landscapes
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58160355A JPS6053025A (ja) | 1983-09-02 | 1983-09-02 | ドライエツチング方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58160355A JPS6053025A (ja) | 1983-09-02 | 1983-09-02 | ドライエツチング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6053025A JPS6053025A (ja) | 1985-03-26 |
| JPH0452613B2 true JPH0452613B2 (https=) | 1992-08-24 |
Family
ID=15713179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58160355A Granted JPS6053025A (ja) | 1983-09-02 | 1983-09-02 | ドライエツチング方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6053025A (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2709058B2 (ja) * | 1987-02-16 | 1998-02-04 | 日本電信電話株式会社 | 光ドライエツチング装置及び方法 |
| JPH02225680A (ja) * | 1989-02-27 | 1990-09-07 | Nippon Telegr & Teleph Corp <Ntt> | 光励起エッチング法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53116077A (en) * | 1977-03-22 | 1978-10-11 | Hitachi Ltd | Etching method |
| JPS56147438A (en) * | 1980-04-16 | 1981-11-16 | Fujitsu Ltd | Microplasma treatment apparatus |
-
1983
- 1983-09-02 JP JP58160355A patent/JPS6053025A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6053025A (ja) | 1985-03-26 |
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