JPS56147438A - Microplasma treatment apparatus - Google Patents
Microplasma treatment apparatusInfo
- Publication number
- JPS56147438A JPS56147438A JP5082680A JP5082680A JPS56147438A JP S56147438 A JPS56147438 A JP S56147438A JP 5082680 A JP5082680 A JP 5082680A JP 5082680 A JP5082680 A JP 5082680A JP S56147438 A JPS56147438 A JP S56147438A
- Authority
- JP
- Japan
- Prior art keywords
- microwave
- plasma
- treatment apparatus
- magnetic field
- transport tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009832 plasma treatment Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma Technology (AREA)
- Drying Of Semiconductors (AREA)
Abstract
PURPOSE:To speed up and ensure the starting of a microwave treatment apparatus by providing an electromagnet near the joint of a wave guide and a plasma transport tube, on the periphery thereof, in order to cause the synchrotron movement of electrons. CONSTITUTION:The order of 0.001-1Torr of CF4 mixed with approximately 5% O2 is introduced to a plasma transport tube 5, which is supplied with a microwave from a microwave oscillator 1 through a waveguide 2, and a magnetic field of 1.5-2 kilogauss is applied to an electromagnet 13 or 13'. Consequently, plasma is generated in a moment and continues to exist if the magnetic field is switched off. At this time, the matching of the microwave circuit becomes stable, so that the protection thereof and the improvement in accuracy of plasma treatment can be attained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5082680A JPS56147438A (en) | 1980-04-16 | 1980-04-16 | Microplasma treatment apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5082680A JPS56147438A (en) | 1980-04-16 | 1980-04-16 | Microplasma treatment apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56147438A true JPS56147438A (en) | 1981-11-16 |
Family
ID=12869565
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5082680A Pending JPS56147438A (en) | 1980-04-16 | 1980-04-16 | Microplasma treatment apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56147438A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59130097A (en) * | 1983-01-14 | 1984-07-26 | 古河電気工業株式会社 | Method of generating discharge plasma |
JPS6053025A (en) * | 1983-09-02 | 1985-03-26 | Hitachi Ltd | Dry etching method |
JPS622244U (en) * | 1985-06-19 | 1987-01-08 | ||
JPS62120738A (en) * | 1985-11-20 | 1987-06-02 | Nec Corp | Pilot signal transmission and reception equipment |
JPS63116399A (en) * | 1986-11-04 | 1988-05-20 | 三菱電機株式会社 | Microwave plasma generator |
JPH03232224A (en) * | 1990-02-07 | 1991-10-16 | Mitsubishi Electric Corp | Plasma processor |
JPH097999A (en) * | 1995-06-20 | 1997-01-10 | Shibaura Eng Works Co Ltd | Dry etching apparatus |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5171597A (en) * | 1974-12-18 | 1976-06-21 | Hitachi Ltd | IONKAKOSOCHI |
JPS53121469A (en) * | 1977-03-31 | 1978-10-23 | Toshiba Corp | Gas etching unit |
-
1980
- 1980-04-16 JP JP5082680A patent/JPS56147438A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5171597A (en) * | 1974-12-18 | 1976-06-21 | Hitachi Ltd | IONKAKOSOCHI |
JPS53121469A (en) * | 1977-03-31 | 1978-10-23 | Toshiba Corp | Gas etching unit |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59130097A (en) * | 1983-01-14 | 1984-07-26 | 古河電気工業株式会社 | Method of generating discharge plasma |
JPS6053025A (en) * | 1983-09-02 | 1985-03-26 | Hitachi Ltd | Dry etching method |
JPH0452613B2 (en) * | 1983-09-02 | 1992-08-24 | Hitachi Ltd | |
JPS622244U (en) * | 1985-06-19 | 1987-01-08 | ||
JPS62120738A (en) * | 1985-11-20 | 1987-06-02 | Nec Corp | Pilot signal transmission and reception equipment |
JPS63116399A (en) * | 1986-11-04 | 1988-05-20 | 三菱電機株式会社 | Microwave plasma generator |
JPH03232224A (en) * | 1990-02-07 | 1991-10-16 | Mitsubishi Electric Corp | Plasma processor |
JPH097999A (en) * | 1995-06-20 | 1997-01-10 | Shibaura Eng Works Co Ltd | Dry etching apparatus |
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