JPH0451902Y2 - - Google Patents
Info
- Publication number
- JPH0451902Y2 JPH0451902Y2 JP18729087U JP18729087U JPH0451902Y2 JP H0451902 Y2 JPH0451902 Y2 JP H0451902Y2 JP 18729087 U JP18729087 U JP 18729087U JP 18729087 U JP18729087 U JP 18729087U JP H0451902 Y2 JPH0451902 Y2 JP H0451902Y2
- Authority
- JP
- Japan
- Prior art keywords
- paste
- needle
- syringe
- injection
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 238000002347 injection Methods 0.000 claims 2
- 239000007924 injection Substances 0.000 claims 2
Landscapes
- Coating Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18729087U JPH0451902Y2 (en, 2012) | 1987-12-09 | 1987-12-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18729087U JPH0451902Y2 (en, 2012) | 1987-12-09 | 1987-12-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0192265U JPH0192265U (en, 2012) | 1989-06-16 |
JPH0451902Y2 true JPH0451902Y2 (en, 2012) | 1992-12-07 |
Family
ID=31478454
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18729087U Expired JPH0451902Y2 (en, 2012) | 1987-12-09 | 1987-12-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0451902Y2 (en, 2012) |
-
1987
- 1987-12-09 JP JP18729087U patent/JPH0451902Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPH0192265U (en, 2012) | 1989-06-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2803221B2 (ja) | Ic実装装置及びその方法 | |
US10773326B2 (en) | Printing device, solder management system, and printing managing method | |
JPH053759B2 (en, 2012) | ||
JPH0451902Y2 (en, 2012) | ||
KR102492922B1 (ko) | 전기 자동차용 pcb 기판의 전자부품 본딩 시스템 | |
JP3425015B2 (ja) | 電子部品アセンブリ装置 | |
JPH069941U (ja) | スクリーン印刷機 | |
KR970011475B1 (ko) | 스크리인 인쇄기 | |
JP2581205B2 (ja) | リプレース装置 | |
JPS61280700A (ja) | チツプ状電子部品の吸着装置 | |
CN217748181U (zh) | 一种智能贴端子机抛料机构 | |
CN220445296U (zh) | 一种辅助激光锡焊加工装置 | |
KR0124607Y1 (ko) | 부품 실장기의 노즐타입 인식장치 | |
JPH1131899A (ja) | 電子部品装着装置 | |
JPH0222146Y2 (en, 2012) | ||
JPH0416960B2 (en, 2012) | ||
KR20180073907A (ko) | 인쇄회로기판 자동 납땜장치 | |
JP2570410Y2 (ja) | ホールコード読取り装置 | |
JP3324400B2 (ja) | 基板移送装置 | |
JPH04334568A (ja) | ボンド塗布装置 | |
JPS6256207A (ja) | 電子部品装着装置 | |
JPH049085Y2 (en, 2012) | ||
CN119595630A (zh) | 一种微波模块智能检测平台和检测方法 | |
JPH0723993Y2 (ja) | 電子チップ部品搭載装置の自動レール幅調整装置 | |
JPH0764642A (ja) | 穴位置認識装置 |