JPH0451868B2 - - Google Patents
Info
- Publication number
- JPH0451868B2 JPH0451868B2 JP31381486A JP31381486A JPH0451868B2 JP H0451868 B2 JPH0451868 B2 JP H0451868B2 JP 31381486 A JP31381486 A JP 31381486A JP 31381486 A JP31381486 A JP 31381486A JP H0451868 B2 JPH0451868 B2 JP H0451868B2
- Authority
- JP
- Japan
- Prior art keywords
- data
- pattern
- land
- pad
- true line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 claims description 46
- 238000013461 design Methods 0.000 claims description 31
- 238000010586 diagram Methods 0.000 claims description 24
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 238000012545 processing Methods 0.000 claims description 10
- 238000007689 inspection Methods 0.000 description 21
- 239000004020 conductor Substances 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Landscapes
- Preparing Plates And Mask In Photomechanical Process (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61313814A JPS63164487A (ja) | 1986-12-26 | 1986-12-26 | プリント配線板用のパタ−ンフィルム作成用デ−タの検査方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61313814A JPS63164487A (ja) | 1986-12-26 | 1986-12-26 | プリント配線板用のパタ−ンフィルム作成用デ−タの検査方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63164487A JPS63164487A (ja) | 1988-07-07 |
| JPH0451868B2 true JPH0451868B2 (enrdf_load_html_response) | 1992-08-20 |
Family
ID=18045834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61313814A Granted JPS63164487A (ja) | 1986-12-26 | 1986-12-26 | プリント配線板用のパタ−ンフィルム作成用デ−タの検査方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63164487A (enrdf_load_html_response) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20250057957A (ko) * | 2019-11-15 | 2025-04-29 | 어플라이드 머티어리얼스, 인코포레이티드 | 설계 파일 내에서의 계층적 구조 정보의 보존 |
-
1986
- 1986-12-26 JP JP61313814A patent/JPS63164487A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63164487A (ja) | 1988-07-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0756878B2 (ja) | プリント配線板の検査方法 | |
| JP4294647B2 (ja) | プリント基板設計装置とｃａｄシステム | |
| CN114266219B (zh) | 一种适用于pcba制程的版图设计优化方法及装置 | |
| US8769471B2 (en) | Producing electrical circuit patterns using multi-population transformation | |
| CN100394335C (zh) | 印刷电路板制造控制器中用以决定定位孔位置的方法 | |
| JPH0451868B2 (enrdf_load_html_response) | ||
| CN116070576B (zh) | 差分信号线线间距修改方法、装置、电子设备及存储介质 | |
| JPH11143917A (ja) | プリント基板検査装置および方法 | |
| CN112347734A (zh) | 集成电路电子自动化设计方法、装置、介质、及设备 | |
| JPS62241392A (ja) | プリント配線板用のパタ−ンフイルム作成用デ−タの検査方法 | |
| CN116402896B (zh) | 一种基于图形算法检查电源结构的方法和系统 | |
| JP2001067390A (ja) | プリント基板設計装置 | |
| JPH0773238A (ja) | 不要ランド削除システム | |
| CN114004193A (zh) | 一种pcb上锡风险的标识方法及相关装置 | |
| JP3241862B2 (ja) | プリント配線板用検査機を作製する際の中継パッド決定方法 | |
| TW202426944A (zh) | 印刷電路板的通孔及連接器引腳自動檢查方法 | |
| CN118446171A (zh) | 印刷电路板的通孔及连接器引脚自动检查方法 | |
| JPH03191590A (ja) | プリント配線基板 | |
| JP2001067389A (ja) | プリント基板設計装置 | |
| CN117252002A (zh) | 一种基于Gerber文件的BGA自动识别方法及装置 | |
| Jones | Schematics and electrical and electronic drawing | |
| JPS62279471A (ja) | 検査用スル−ホ−ルをもつプリント基板の配線設計方法 | |
| Panchak et al. | Variants of Topology Editing Strategy in the Subsystem of Printed Circuit Boards Manufacturability Improvement | |
| JPH05226820A (ja) | プリント配線板 | |
| JPH0452874A (ja) | フィルムパターン検査装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |