JPH0451175U - - Google Patents
Info
- Publication number
- JPH0451175U JPH0451175U JP9345790U JP9345790U JPH0451175U JP H0451175 U JPH0451175 U JP H0451175U JP 9345790 U JP9345790 U JP 9345790U JP 9345790 U JP9345790 U JP 9345790U JP H0451175 U JPH0451175 U JP H0451175U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- wiring conductor
- multilayer printed
- electrically connect
- inner diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Description
第１図および第２図はこの考案の実施例に係る
多層プリント配線基板の構造を表す図であり、第
１図は断面図、第２図は上面図である。第３図〜
第５図は従来の多層プリント配線基板の構造およ
びその製造過程を表す断面図である。
１，２……外層配線導体、３……内層配線導体
、３ａ……内層配線導体の切削面、４……ガラス
エポキシ樹脂基材、４′……エポキシ樹脂、５…
…スルーホールメツキ部、６……大径スルーホー
ル、７……小径スルーホール、８……連絡用メツ
キ部。
1 and 2 are diagrams showing the structure of a multilayer printed wiring board according to an embodiment of this invention, with FIG. 1 being a sectional view and FIG. 2 being a top view. Figure 3~
FIG. 5 is a sectional view showing the structure of a conventional multilayer printed wiring board and its manufacturing process. DESCRIPTION OF SYMBOLS 1, 2... Outer layer wiring conductor, 3... Inner layer wiring conductor, 3a... Cutting surface of inner layer wiring conductor, 4... Glass epoxy resin base material, 4'... Epoxy resin, 5...
...Through hole plating part, 6... Large diameter through hole, 7... Small diameter through hole, 8... Connection plating part.
Claims (1)
ールを有する多層プリント配線基板において、 上記スルーホールの接続する各配線導体にそれ
ぞれ共通の内層配線導体と外層配線導体間を電気
的に接続する、上記スルーホールの内径より小さ
な内径を有する導通専用スルーホールを形成した
ことを特徴とする多層プリント配線基板。[Scope of Claim for Utility Model Registration] In a multilayer printed wiring board having through holes that electrically connect wiring conductors in multiple layers, between an inner layer wiring conductor and an outer layer wiring conductor that are common to each wiring conductor connected to the through hole. 1. A multilayer printed wiring board, characterized in that a conduction-only through hole having an inner diameter smaller than the inner diameter of the above-mentioned through hole is formed to electrically connect the through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9345790U JPH0451175U (en) | 1990-09-04 | 1990-09-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9345790U JPH0451175U (en) | 1990-09-04 | 1990-09-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0451175U true JPH0451175U (en) | 1992-04-30 |
Family
ID=31830685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9345790U Pending JPH0451175U (en) | 1990-09-04 | 1990-09-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0451175U (en) |
-
1990
- 1990-09-04 JP JP9345790U patent/JPH0451175U/ja active Pending