JPH0451073B2 - - Google Patents

Info

Publication number
JPH0451073B2
JPH0451073B2 JP1182884A JP1182884A JPH0451073B2 JP H0451073 B2 JPH0451073 B2 JP H0451073B2 JP 1182884 A JP1182884 A JP 1182884A JP 1182884 A JP1182884 A JP 1182884A JP H0451073 B2 JPH0451073 B2 JP H0451073B2
Authority
JP
Japan
Prior art keywords
layer
semiconductor
intermediate member
semiconductor laser
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1182884A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60157284A (ja
Inventor
Yasutoshi Kurihara
Tadashi Minagawa
Komei Yatsuno
Kazuhiro Hirose
Koichi Shinohara
Tomiro Yasuda
Mamoru Sawahata
Tadao Kushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59011828A priority Critical patent/JPS60157284A/ja
Publication of JPS60157284A publication Critical patent/JPS60157284A/ja
Publication of JPH0451073B2 publication Critical patent/JPH0451073B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)
  • Die Bonding (AREA)
JP59011828A 1984-01-27 1984-01-27 半導体装置 Granted JPS60157284A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59011828A JPS60157284A (ja) 1984-01-27 1984-01-27 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59011828A JPS60157284A (ja) 1984-01-27 1984-01-27 半導体装置

Publications (2)

Publication Number Publication Date
JPS60157284A JPS60157284A (ja) 1985-08-17
JPH0451073B2 true JPH0451073B2 (https=) 1992-08-18

Family

ID=11788622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59011828A Granted JPS60157284A (ja) 1984-01-27 1984-01-27 半導体装置

Country Status (1)

Country Link
JP (1) JPS60157284A (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63132495A (ja) * 1986-11-21 1988-06-04 Mitsubishi Electric Corp 光半導体素子用サブマウント
JPS63160292A (ja) * 1986-12-23 1988-07-04 Mitsubishi Electric Corp 光半導体素子用サブマウント
JP4855341B2 (ja) * 2007-06-05 2012-01-18 株式会社パイロットコーポレーション ノック式筆記具
JP2009272656A (ja) * 2009-08-20 2009-11-19 Sumitomo Electric Ind Ltd 半導体発光素子及びその製造方法
CN104040809B (zh) * 2012-04-05 2017-03-22 松下知识产权经营株式会社 半导体激光器装置以及其制造方法
JP7619812B2 (ja) 2021-01-28 2025-01-22 ゼブラ株式会社 出没式筆記具

Also Published As

Publication number Publication date
JPS60157284A (ja) 1985-08-17

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