JPS60157284A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS60157284A
JPS60157284A JP59011828A JP1182884A JPS60157284A JP S60157284 A JPS60157284 A JP S60157284A JP 59011828 A JP59011828 A JP 59011828A JP 1182884 A JP1182884 A JP 1182884A JP S60157284 A JPS60157284 A JP S60157284A
Authority
JP
Japan
Prior art keywords
intermediate member
layer
solder
substrate
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59011828A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0451073B2 (https=
Inventor
Yasutoshi Kurihara
保敏 栗原
Tadashi Minagawa
皆川 忠
Komei Yatsuno
八野 耕明
Kazuhiro Hirose
広瀬 一弘
Koichi Shinohara
浩一 篠原
Tomiro Yasuda
安田 冨郎
Mamoru Sawahata
沢畠 守
Tadao Kushima
九嶋 忠雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59011828A priority Critical patent/JPS60157284A/ja
Publication of JPS60157284A publication Critical patent/JPS60157284A/ja
Publication of JPH0451073B2 publication Critical patent/JPH0451073B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/857Interconnections, e.g. lead-frames, bond wires or solder balls
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/0235Method for mounting laser chips
    • H01S5/02355Fixing laser chips on mounts
    • H01S5/0237Fixing laser chips on mounts by soldering
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/536Shapes of wire connectors the connected ends being ball-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/5363Shapes of wire connectors the connected ends being wedge-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/551Materials of bond wires
    • H10W72/552Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)
  • Die Bonding (AREA)
JP59011828A 1984-01-27 1984-01-27 半導体装置 Granted JPS60157284A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59011828A JPS60157284A (ja) 1984-01-27 1984-01-27 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59011828A JPS60157284A (ja) 1984-01-27 1984-01-27 半導体装置

Publications (2)

Publication Number Publication Date
JPS60157284A true JPS60157284A (ja) 1985-08-17
JPH0451073B2 JPH0451073B2 (https=) 1992-08-18

Family

ID=11788622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59011828A Granted JPS60157284A (ja) 1984-01-27 1984-01-27 半導体装置

Country Status (1)

Country Link
JP (1) JPS60157284A (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63132495A (ja) * 1986-11-21 1988-06-04 Mitsubishi Electric Corp 光半導体素子用サブマウント
JPS63160292A (ja) * 1986-12-23 1988-07-04 Mitsubishi Electric Corp 光半導体素子用サブマウント
JP2008302504A (ja) * 2007-06-05 2008-12-18 Pilot Corporation ノック式筆記具
JP2009272656A (ja) * 2009-08-20 2009-11-19 Sumitomo Electric Ind Ltd 半導体発光素子及びその製造方法
JPWO2013150715A1 (ja) * 2012-04-05 2015-12-17 パナソニックIpマネジメント株式会社 半導体レーザ装置およびその製造方法
KR20220109266A (ko) 2021-01-28 2022-08-04 제브라 가부시키가이샤 출몰식 필기구

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63132495A (ja) * 1986-11-21 1988-06-04 Mitsubishi Electric Corp 光半導体素子用サブマウント
JPS63160292A (ja) * 1986-12-23 1988-07-04 Mitsubishi Electric Corp 光半導体素子用サブマウント
JP2008302504A (ja) * 2007-06-05 2008-12-18 Pilot Corporation ノック式筆記具
JP2009272656A (ja) * 2009-08-20 2009-11-19 Sumitomo Electric Ind Ltd 半導体発光素子及びその製造方法
JPWO2013150715A1 (ja) * 2012-04-05 2015-12-17 パナソニックIpマネジメント株式会社 半導体レーザ装置およびその製造方法
KR20220109266A (ko) 2021-01-28 2022-08-04 제브라 가부시키가이샤 출몰식 필기구

Also Published As

Publication number Publication date
JPH0451073B2 (https=) 1992-08-18

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