JPS60157284A - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS60157284A JPS60157284A JP59011828A JP1182884A JPS60157284A JP S60157284 A JPS60157284 A JP S60157284A JP 59011828 A JP59011828 A JP 59011828A JP 1182884 A JP1182884 A JP 1182884A JP S60157284 A JPS60157284 A JP S60157284A
- Authority
- JP
- Japan
- Prior art keywords
- intermediate member
- layer
- solder
- substrate
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0237—Fixing laser chips on mounts by soldering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
Landscapes
- Led Device Packages (AREA)
- Semiconductor Lasers (AREA)
- Led Devices (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59011828A JPS60157284A (ja) | 1984-01-27 | 1984-01-27 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59011828A JPS60157284A (ja) | 1984-01-27 | 1984-01-27 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60157284A true JPS60157284A (ja) | 1985-08-17 |
| JPH0451073B2 JPH0451073B2 (https=) | 1992-08-18 |
Family
ID=11788622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59011828A Granted JPS60157284A (ja) | 1984-01-27 | 1984-01-27 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60157284A (https=) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63132495A (ja) * | 1986-11-21 | 1988-06-04 | Mitsubishi Electric Corp | 光半導体素子用サブマウント |
| JPS63160292A (ja) * | 1986-12-23 | 1988-07-04 | Mitsubishi Electric Corp | 光半導体素子用サブマウント |
| JP2008302504A (ja) * | 2007-06-05 | 2008-12-18 | Pilot Corporation | ノック式筆記具 |
| JP2009272656A (ja) * | 2009-08-20 | 2009-11-19 | Sumitomo Electric Ind Ltd | 半導体発光素子及びその製造方法 |
| JPWO2013150715A1 (ja) * | 2012-04-05 | 2015-12-17 | パナソニックIpマネジメント株式会社 | 半導体レーザ装置およびその製造方法 |
| KR20220109266A (ko) | 2021-01-28 | 2022-08-04 | 제브라 가부시키가이샤 | 출몰식 필기구 |
-
1984
- 1984-01-27 JP JP59011828A patent/JPS60157284A/ja active Granted
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63132495A (ja) * | 1986-11-21 | 1988-06-04 | Mitsubishi Electric Corp | 光半導体素子用サブマウント |
| JPS63160292A (ja) * | 1986-12-23 | 1988-07-04 | Mitsubishi Electric Corp | 光半導体素子用サブマウント |
| JP2008302504A (ja) * | 2007-06-05 | 2008-12-18 | Pilot Corporation | ノック式筆記具 |
| JP2009272656A (ja) * | 2009-08-20 | 2009-11-19 | Sumitomo Electric Ind Ltd | 半導体発光素子及びその製造方法 |
| JPWO2013150715A1 (ja) * | 2012-04-05 | 2015-12-17 | パナソニックIpマネジメント株式会社 | 半導体レーザ装置およびその製造方法 |
| KR20220109266A (ko) | 2021-01-28 | 2022-08-04 | 제브라 가부시키가이샤 | 출몰식 필기구 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0451073B2 (https=) | 1992-08-18 |
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