JPH0449781B2 - - Google Patents

Info

Publication number
JPH0449781B2
JPH0449781B2 JP58179845A JP17984583A JPH0449781B2 JP H0449781 B2 JPH0449781 B2 JP H0449781B2 JP 58179845 A JP58179845 A JP 58179845A JP 17984583 A JP17984583 A JP 17984583A JP H0449781 B2 JPH0449781 B2 JP H0449781B2
Authority
JP
Japan
Prior art keywords
chip
pattern
circuit
circuit board
molding agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58179845A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6071980A (ja
Inventor
Kunio Sakuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP58179845A priority Critical patent/JPS6071980A/ja
Priority to CH694183A priority patent/CH660551GA3/fr
Publication of JPS6071980A publication Critical patent/JPS6071980A/ja
Priority to US06/891,084 priority patent/US4644445A/en
Publication of JPH0449781B2 publication Critical patent/JPH0449781B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H10W74/012—
    • H10W74/15—
    • H10W70/681—
    • H10W72/01308—
    • H10W72/07236—
    • H10W72/07251—
    • H10W72/07311—
    • H10W72/07353—
    • H10W72/20—
    • H10W72/251—
    • H10W72/334—
    • H10W72/856—
    • H10W72/931—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Clocks (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP58179845A 1982-12-27 1983-09-28 回路実装構造 Granted JPS6071980A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP58179845A JPS6071980A (ja) 1983-09-28 1983-09-28 回路実装構造
CH694183A CH660551GA3 (cg-RX-API-DMAC10.html) 1982-12-27 1983-12-27
US06/891,084 US4644445A (en) 1982-12-27 1986-07-31 Resin mounting structure for an integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58179845A JPS6071980A (ja) 1983-09-28 1983-09-28 回路実装構造

Publications (2)

Publication Number Publication Date
JPS6071980A JPS6071980A (ja) 1985-04-23
JPH0449781B2 true JPH0449781B2 (cg-RX-API-DMAC10.html) 1992-08-12

Family

ID=16072904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58179845A Granted JPS6071980A (ja) 1982-12-27 1983-09-28 回路実装構造

Country Status (1)

Country Link
JP (1) JPS6071980A (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63139589U (cg-RX-API-DMAC10.html) * 1987-03-05 1988-09-14
KR100598032B1 (ko) * 2003-12-03 2006-07-07 삼성전자주식회사 테이프 배선 기판, 그를 이용한 반도체 칩 패키지 및 그를이용한 디스플레이패널 어셈블리

Also Published As

Publication number Publication date
JPS6071980A (ja) 1985-04-23

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