JPS6071980A - 回路実装構造 - Google Patents

回路実装構造

Info

Publication number
JPS6071980A
JPS6071980A JP58179845A JP17984583A JPS6071980A JP S6071980 A JPS6071980 A JP S6071980A JP 58179845 A JP58179845 A JP 58179845A JP 17984583 A JP17984583 A JP 17984583A JP S6071980 A JPS6071980 A JP S6071980A
Authority
JP
Japan
Prior art keywords
chip
pattern
molding agent
circuit board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58179845A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0449781B2 (cg-RX-API-DMAC10.html
Inventor
Kunio Sakuma
佐久間　国雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP58179845A priority Critical patent/JPS6071980A/ja
Priority to CH694183A priority patent/CH660551GA3/fr
Publication of JPS6071980A publication Critical patent/JPS6071980A/ja
Priority to US06/891,084 priority patent/US4644445A/en
Publication of JPH0449781B2 publication Critical patent/JPH0449781B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H10W74/012—
    • H10W74/15—
    • H10W70/681—
    • H10W72/01308—
    • H10W72/07236—
    • H10W72/07251—
    • H10W72/07311—
    • H10W72/07353—
    • H10W72/20—
    • H10W72/251—
    • H10W72/334—
    • H10W72/856—
    • H10W72/931—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Clocks (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP58179845A 1982-12-27 1983-09-28 回路実装構造 Granted JPS6071980A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP58179845A JPS6071980A (ja) 1983-09-28 1983-09-28 回路実装構造
CH694183A CH660551GA3 (cg-RX-API-DMAC10.html) 1982-12-27 1983-12-27
US06/891,084 US4644445A (en) 1982-12-27 1986-07-31 Resin mounting structure for an integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58179845A JPS6071980A (ja) 1983-09-28 1983-09-28 回路実装構造

Publications (2)

Publication Number Publication Date
JPS6071980A true JPS6071980A (ja) 1985-04-23
JPH0449781B2 JPH0449781B2 (cg-RX-API-DMAC10.html) 1992-08-12

Family

ID=16072904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58179845A Granted JPS6071980A (ja) 1982-12-27 1983-09-28 回路実装構造

Country Status (1)

Country Link
JP (1) JPS6071980A (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63139589U (cg-RX-API-DMAC10.html) * 1987-03-05 1988-09-14
JP2005167238A (ja) * 2003-12-03 2005-06-23 Samsung Electronics Co Ltd テープ配線基板、それを用いた半導体チップパッケージ及びそれを用いたディスプレイパネルアセンブル

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63139589U (cg-RX-API-DMAC10.html) * 1987-03-05 1988-09-14
JP2005167238A (ja) * 2003-12-03 2005-06-23 Samsung Electronics Co Ltd テープ配線基板、それを用いた半導体チップパッケージ及びそれを用いたディスプレイパネルアセンブル

Also Published As

Publication number Publication date
JPH0449781B2 (cg-RX-API-DMAC10.html) 1992-08-12

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