JPH0449252B2 - - Google Patents

Info

Publication number
JPH0449252B2
JPH0449252B2 JP21079485A JP21079485A JPH0449252B2 JP H0449252 B2 JPH0449252 B2 JP H0449252B2 JP 21079485 A JP21079485 A JP 21079485A JP 21079485 A JP21079485 A JP 21079485A JP H0449252 B2 JPH0449252 B2 JP H0449252B2
Authority
JP
Japan
Prior art keywords
lead frame
chuck
charging
lower mold
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP21079485A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6270013A (ja
Inventor
Toshiji Nakajo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP21079485A priority Critical patent/JPS6270013A/ja
Publication of JPS6270013A publication Critical patent/JPS6270013A/ja
Publication of JPH0449252B2 publication Critical patent/JPH0449252B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP21079485A 1985-09-24 1985-09-24 電子部品封止成形における成形金型装置へのリ−ドフレ−ム投入方法 Granted JPS6270013A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21079485A JPS6270013A (ja) 1985-09-24 1985-09-24 電子部品封止成形における成形金型装置へのリ−ドフレ−ム投入方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21079485A JPS6270013A (ja) 1985-09-24 1985-09-24 電子部品封止成形における成形金型装置へのリ−ドフレ−ム投入方法

Publications (2)

Publication Number Publication Date
JPS6270013A JPS6270013A (ja) 1987-03-31
JPH0449252B2 true JPH0449252B2 (enrdf_load_stackoverflow) 1992-08-11

Family

ID=16595240

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21079485A Granted JPS6270013A (ja) 1985-09-24 1985-09-24 電子部品封止成形における成形金型装置へのリ−ドフレ−ム投入方法

Country Status (1)

Country Link
JP (1) JPS6270013A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2505051B2 (ja) * 1990-02-01 1996-06-05 三菱電機株式会社 半導体素子用樹脂封止装置及び半導体装置の製造方法
US5391346A (en) * 1991-11-20 1995-02-21 Rohm Co., Ltd. Method for making molded photointerrupters
SG66304A1 (en) * 1996-04-25 1999-07-20 Fastech System S Pte Ltd Injection moulding apparatus and method
DE19949851C2 (de) * 1999-10-15 2001-09-13 Hekuma Herbst Maschb Gmbh Kunststoff-Spritzgießmaschine, Handlingsystem sowie Verfahren zum Überführen eines Gegenstandes
KR100481407B1 (ko) * 2002-03-13 2005-04-07 한양로보틱스 주식회사 취출기의 인서트위치 계측장치

Also Published As

Publication number Publication date
JPS6270013A (ja) 1987-03-31

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