JPH0447964Y2 - - Google Patents
Info
- Publication number
- JPH0447964Y2 JPH0447964Y2 JP1985052100U JP5210085U JPH0447964Y2 JP H0447964 Y2 JPH0447964 Y2 JP H0447964Y2 JP 1985052100 U JP1985052100 U JP 1985052100U JP 5210085 U JP5210085 U JP 5210085U JP H0447964 Y2 JPH0447964 Y2 JP H0447964Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- bending
- support means
- bent
- roller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005452 bending Methods 0.000 claims description 43
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003462 Bender reaction Methods 0.000 description 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985052100U JPH0447964Y2 (de) | 1985-04-10 | 1985-04-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985052100U JPH0447964Y2 (de) | 1985-04-10 | 1985-04-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61168646U JPS61168646U (de) | 1986-10-20 |
JPH0447964Y2 true JPH0447964Y2 (de) | 1992-11-12 |
Family
ID=30571744
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985052100U Expired JPH0447964Y2 (de) | 1985-04-10 | 1985-04-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0447964Y2 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2820127B2 (ja) * | 1996-07-29 | 1998-11-05 | 株式会社日立製作所 | 半導体のリード曲げ加工法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58148946U (ja) * | 1982-03-31 | 1983-10-06 | 富士通株式会社 | 曲げ型 |
-
1985
- 1985-04-10 JP JP1985052100U patent/JPH0447964Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS61168646U (de) | 1986-10-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5078186A (en) | Lead forming for electronic parts having gull wing type outer leads | |
US4829669A (en) | Method of manufacturing a chip carrier | |
JPH0447964Y2 (de) | ||
JPH02284455A (ja) | 半導体装置のリード成型方法 | |
GB2024054A (en) | Stamping tools | |
JP2556716B2 (ja) | リードフォーミング装置 | |
JPH0510174B2 (de) | ||
JPH0710807Y2 (ja) | 曲げ加工用プレス型 | |
JPH06169050A (ja) | 半導体装置の製造方法 | |
JPS6244422B2 (de) | ||
CN216175866U (zh) | 一种小尺寸高精度折弯模 | |
JPH073200U (ja) | 電子部品の基板装着治具 | |
JP3129519B2 (ja) | リード成形方法 | |
JPH08340070A (ja) | 電子部品におけるリード端子の曲げ加工装置 | |
JPH0129792Y2 (de) | ||
JPH05183084A (ja) | リード端子のプレス方法及びプレス装置 | |
JP2536435B2 (ja) | 半導体パッケ―ジのリ―ド成形方法及び装置 | |
JPS61242724A (ja) | 凹溝を有するプレス製品の加工方法 | |
JPH06176987A (ja) | 面実装型電子部品におけるリード端子の曲げ加工方法 | |
KR910005513Y1 (ko) | 가변저항기의 리드단자 결합장치 | |
JP2708343B2 (ja) | 半導体装置の製造方法およびリードフレーム | |
KR940006998Y1 (ko) | 벤딩 및 코킹장치 | |
JP2726042B2 (ja) | 半導体装置 | |
JPH04196257A (ja) | 半導体装置のリード成形方法 | |
JPH0831550B2 (ja) | 半導体の切断整形金型 |