JPH0447905Y2 - - Google Patents
Info
- Publication number
- JPH0447905Y2 JPH0447905Y2 JP1985166729U JP16672985U JPH0447905Y2 JP H0447905 Y2 JPH0447905 Y2 JP H0447905Y2 JP 1985166729 U JP1985166729 U JP 1985166729U JP 16672985 U JP16672985 U JP 16672985U JP H0447905 Y2 JPH0447905 Y2 JP H0447905Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- flexible printed
- wiring pattern
- pressure plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011295 pitch Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985166729U JPH0447905Y2 (US08066781-20111129-C00013.png) | 1985-10-31 | 1985-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985166729U JPH0447905Y2 (US08066781-20111129-C00013.png) | 1985-10-31 | 1985-10-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6276478U JPS6276478U (US08066781-20111129-C00013.png) | 1987-05-16 |
| JPH0447905Y2 true JPH0447905Y2 (US08066781-20111129-C00013.png) | 1992-11-11 |
Family
ID=31097985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985166729U Expired JPH0447905Y2 (US08066781-20111129-C00013.png) | 1985-10-31 | 1985-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0447905Y2 (US08066781-20111129-C00013.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0610583Y2 (ja) * | 1987-06-10 | 1994-03-16 | 松下電器産業株式会社 | メンブレンスイツチ |
| JP2690096B2 (ja) * | 1988-02-09 | 1997-12-10 | キヤノン株式会社 | プリント配線板の接続部の構造 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4811382B1 (US08066781-20111129-C00013.png) * | 1967-05-15 | 1973-04-12 | ||
| JPS5467691A (en) * | 1977-11-09 | 1979-05-31 | Daiichi Denshi Kogyo | Method of connecting conduction portion and conductive pressure sensing adhesives |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5212951Y2 (US08066781-20111129-C00013.png) * | 1971-06-21 | 1977-03-23 |
-
1985
- 1985-10-31 JP JP1985166729U patent/JPH0447905Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4811382B1 (US08066781-20111129-C00013.png) * | 1967-05-15 | 1973-04-12 | ||
| JPS5467691A (en) * | 1977-11-09 | 1979-05-31 | Daiichi Denshi Kogyo | Method of connecting conduction portion and conductive pressure sensing adhesives |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6276478U (US08066781-20111129-C00013.png) | 1987-05-16 |
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