JPH044742U - - Google Patents

Info

Publication number
JPH044742U
JPH044742U JP4472790U JP4472790U JPH044742U JP H044742 U JPH044742 U JP H044742U JP 4472790 U JP4472790 U JP 4472790U JP 4472790 U JP4472790 U JP 4472790U JP H044742 U JPH044742 U JP H044742U
Authority
JP
Japan
Prior art keywords
metal mask
semiconductor wafer
chip
mounting table
electromagnet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4472790U
Other languages
English (en)
Other versions
JPH087628Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4472790U priority Critical patent/JPH087628Y2/ja
Publication of JPH044742U publication Critical patent/JPH044742U/ja
Application granted granted Critical
Publication of JPH087628Y2 publication Critical patent/JPH087628Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11005—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for aligning the bump connector, e.g. marks, spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/742—Apparatus for manufacturing bump connectors

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図ａ，ｂは従来装置の平面構造図、側面構
造図、第２図は部分構造図、第３図ａ，ｂは本考
案の実施例をしめす平面構造図、側面構造図、第
３図ｃは他の実施例をしめす側面構造図であり、
１は半導体ウエハ又はチツプ、２は載置台、３は
金属マスク、４は押え止め具、５はマスク穴、６
は半田粒、７は電磁石、８は永久磁石、９はフラ
ツクスである。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体ウエハ又はチツプを載置する載置台と、
    半田粒の入る穴を設けた金属マスクから成り、前
    記載置台に電磁石又は永久磁石を内蔵せしめて、
    載置した半導体ウエハ又はチツプ上の前記金属マ
    スクを前記載置台側に吸引するようにしたことを
    特徴とする金属マスク押圧装置。
JP4472790U 1990-04-26 1990-04-26 金属マスク押圧装置 Expired - Lifetime JPH087628Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4472790U JPH087628Y2 (ja) 1990-04-26 1990-04-26 金属マスク押圧装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4472790U JPH087628Y2 (ja) 1990-04-26 1990-04-26 金属マスク押圧装置

Publications (2)

Publication Number Publication Date
JPH044742U true JPH044742U (ja) 1992-01-16
JPH087628Y2 JPH087628Y2 (ja) 1996-03-04

Family

ID=31558284

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4472790U Expired - Lifetime JPH087628Y2 (ja) 1990-04-26 1990-04-26 金属マスク押圧装置

Country Status (1)

Country Link
JP (1) JPH087628Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010050470A (ja) * 1996-08-27 2010-03-04 Nippon Steel Materials Co Ltd ウエハー

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010050470A (ja) * 1996-08-27 2010-03-04 Nippon Steel Materials Co Ltd ウエハー

Also Published As

Publication number Publication date
JPH087628Y2 (ja) 1996-03-04

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term