JPS6252942U - - Google Patents
Info
- Publication number
- JPS6252942U JPS6252942U JP1985144495U JP14449585U JPS6252942U JP S6252942 U JPS6252942 U JP S6252942U JP 1985144495 U JP1985144495 U JP 1985144495U JP 14449585 U JP14449585 U JP 14449585U JP S6252942 U JPS6252942 U JP S6252942U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- circuit board
- printed circuit
- mounting hole
- fit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Description
第１図はこの考案のＩＣチツプ用ヒートシンク
の一実施例をプリント基板に取付けた状態を示す
断面図、第２図ａおよびｂはそれぞれ上記実施例
の平面図および側面図、第３図はこの考案のＩＣ
チツプ用ヒートシンクの他の実施例のプリント基
板取付状態を示す断面図、第４図ａおよびｂはそ
の平面図および側面図、第５図はＩＣチツプ用ヒ
ートシンクの従来例の断面図である。 １……プリント基板、２……取付け穴、８，８
′……位置決め部。
の一実施例をプリント基板に取付けた状態を示す
断面図、第２図ａおよびｂはそれぞれ上記実施例
の平面図および側面図、第３図はこの考案のＩＣ
チツプ用ヒートシンクの他の実施例のプリント基
板取付状態を示す断面図、第４図ａおよびｂはそ
の平面図および側面図、第５図はＩＣチツプ用ヒ
ートシンクの従来例の断面図である。 １……プリント基板、２……取付け穴、８，８
′……位置決め部。
Claims (1)
- プリント基板に取付けた状態においてヒートシ
ンクの外面および外周面が露出されるよう、プリ
ント基板に設けた取付け穴に嵌合する位置決め部
を形成したことを特徴とする半導体集積回路チツ
プ用ヒートシンク。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985144495U JPH043503Y2 (ja) | 1985-09-20 | 1985-09-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985144495U JPH043503Y2 (ja) | 1985-09-20 | 1985-09-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6252942U true JPS6252942U (ja) | 1987-04-02 |
| JPH043503Y2 JPH043503Y2 (ja) | 1992-02-04 |
Family
ID=31055152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985144495U Expired JPH043503Y2 (ja) | 1985-09-20 | 1985-09-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH043503Y2 (ja) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4818069U (ja) * | 1971-07-07 | 1973-03-01 | ||
| JPS5993170U (ja) * | 1982-12-15 | 1984-06-25 | 三洋電機株式会社 | フラツトパツケ−ジ型ｉｃの取付構造 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4818069B1 (ja) * | 1968-09-28 | 1973-06-02 |
-
1985
- 1985-09-20 JP JP1985144495U patent/JPH043503Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4818069U (ja) * | 1971-07-07 | 1973-03-01 | ||
| JPS5993170U (ja) * | 1982-12-15 | 1984-06-25 | 三洋電機株式会社 | フラツトパツケ−ジ型ｉｃの取付構造 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH043503Y2 (ja) | 1992-02-04 |