JPH0445580B2 - - Google Patents
Info
- Publication number
- JPH0445580B2 JPH0445580B2 JP61253144A JP25314486A JPH0445580B2 JP H0445580 B2 JPH0445580 B2 JP H0445580B2 JP 61253144 A JP61253144 A JP 61253144A JP 25314486 A JP25314486 A JP 25314486A JP H0445580 B2 JPH0445580 B2 JP H0445580B2
- Authority
- JP
- Japan
- Prior art keywords
- evaporation source
- ion plating
- excitation means
- substrate
- shield
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001704 evaporation Methods 0.000 claims description 26
- 230000008020 evaporation Effects 0.000 claims description 26
- 230000005284 excitation Effects 0.000 claims description 22
- 238000007733 ion plating Methods 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 11
- 239000002245 particle Substances 0.000 claims description 8
- 239000010409 thin film Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 239000007789 gas Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000010408 film Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25314486A JPS63109162A (ja) | 1986-10-24 | 1986-10-24 | イオンプレ−テイング方法とその装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25314486A JPS63109162A (ja) | 1986-10-24 | 1986-10-24 | イオンプレ−テイング方法とその装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63109162A JPS63109162A (ja) | 1988-05-13 |
| JPH0445580B2 true JPH0445580B2 (US20110105765A1-20110505-C00013.png) | 1992-07-27 |
Family
ID=17247127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25314486A Granted JPS63109162A (ja) | 1986-10-24 | 1986-10-24 | イオンプレ−テイング方法とその装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63109162A (US20110105765A1-20110505-C00013.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09209131A (ja) * | 1996-02-08 | 1997-08-12 | Ricoh Co Ltd | 薄膜形成装置 |
| JPH09228046A (ja) * | 1996-02-23 | 1997-09-02 | Ricoh Co Ltd | 巻き取り式成膜装置 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003012160A1 (fr) * | 2001-07-31 | 2003-02-13 | Asahi Optronics, Ltd. | Systeme de galvanoplastie haute frequence par depot par evaporation sous vide |
| JP2003188115A (ja) * | 2001-12-17 | 2003-07-04 | Shin Meiwa Ind Co Ltd | 半導体配線形成方法及び装置、半導体デバイス製造方法及び装置、並びにウエハ |
| DE102015210460B4 (de) * | 2015-06-08 | 2021-10-07 | Te Connectivity Germany Gmbh | Verfahren zur Veränderung mechanischer und/oder elektrischer Eigenschaften zumindest eines Bereichs eines elektrischen Kontaktelements |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5084472A (US20110105765A1-20110505-C00013.png) * | 1973-11-30 | 1975-07-08 | ||
| JPS5311175A (en) * | 1976-07-19 | 1978-02-01 | Ulvac Corp | High frequency ion plating apparatus |
-
1986
- 1986-10-24 JP JP25314486A patent/JPS63109162A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5084472A (US20110105765A1-20110505-C00013.png) * | 1973-11-30 | 1975-07-08 | ||
| JPS5311175A (en) * | 1976-07-19 | 1978-02-01 | Ulvac Corp | High frequency ion plating apparatus |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09209131A (ja) * | 1996-02-08 | 1997-08-12 | Ricoh Co Ltd | 薄膜形成装置 |
| JPH09228046A (ja) * | 1996-02-23 | 1997-09-02 | Ricoh Co Ltd | 巻き取り式成膜装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63109162A (ja) | 1988-05-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |