JPH0445580B2 - - Google Patents
Info
- Publication number
- JPH0445580B2 JPH0445580B2 JP61253144A JP25314486A JPH0445580B2 JP H0445580 B2 JPH0445580 B2 JP H0445580B2 JP 61253144 A JP61253144 A JP 61253144A JP 25314486 A JP25314486 A JP 25314486A JP H0445580 B2 JPH0445580 B2 JP H0445580B2
- Authority
- JP
- Japan
- Prior art keywords
- evaporation source
- ion plating
- excitation means
- substrate
- shield
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP25314486A JPS63109162A (ja) | 1986-10-24 | 1986-10-24 | イオンプレ−テイング方法とその装置 | 
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP25314486A JPS63109162A (ja) | 1986-10-24 | 1986-10-24 | イオンプレ−テイング方法とその装置 | 
Publications (2)
| Publication Number | Publication Date | 
|---|---|
| JPS63109162A JPS63109162A (ja) | 1988-05-13 | 
| JPH0445580B2 true JPH0445580B2 (OSRAM) | 1992-07-27 | 
Family
ID=17247127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| JP25314486A Granted JPS63109162A (ja) | 1986-10-24 | 1986-10-24 | イオンプレ−テイング方法とその装置 | 
Country Status (1)
| Country | Link | 
|---|---|
| JP (1) | JPS63109162A (OSRAM) | 
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPH09209131A (ja) * | 1996-02-08 | 1997-08-12 | Ricoh Co Ltd | 薄膜形成装置 | 
| JPH09228046A (ja) * | 1996-02-23 | 1997-09-02 | Ricoh Co Ltd | 巻き取り式成膜装置 | 
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| WO2003012160A1 (fr) * | 2001-07-31 | 2003-02-13 | Asahi Optronics, Ltd. | Systeme de galvanoplastie haute frequence par depot par evaporation sous vide | 
| JP2003188115A (ja) * | 2001-12-17 | 2003-07-04 | Shin Meiwa Ind Co Ltd | 半導体配線形成方法及び装置、半導体デバイス製造方法及び装置、並びにウエハ | 
| DE102015210460B4 (de) | 2015-06-08 | 2021-10-07 | Te Connectivity Germany Gmbh | Verfahren zur Veränderung mechanischer und/oder elektrischer Eigenschaften zumindest eines Bereichs eines elektrischen Kontaktelements | 
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPS535871B2 (OSRAM) * | 1973-11-30 | 1978-03-02 | ||
| JPS5311175A (en) * | 1976-07-19 | 1978-02-01 | Ulvac Corp | High frequency ion plating apparatus | 
- 
        1986
        - 1986-10-24 JP JP25314486A patent/JPS63109162A/ja active Granted
 
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPH09209131A (ja) * | 1996-02-08 | 1997-08-12 | Ricoh Co Ltd | 薄膜形成装置 | 
| JPH09228046A (ja) * | 1996-02-23 | 1997-09-02 | Ricoh Co Ltd | 巻き取り式成膜装置 | 
Also Published As
| Publication number | Publication date | 
|---|---|
| JPS63109162A (ja) | 1988-05-13 | 
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Legal Events
| Date | Code | Title | Description | 
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |