JPH0441931B2 - - Google Patents

Info

Publication number

JPH0441931B2

JPH0441931B2 JP60175652A JP17565285A JPH0441931B2 JP H0441931 B2 JPH0441931 B2 JP H0441931B2 JP 60175652 A JP60175652 A JP 60175652A JP 17565285 A JP17565285 A JP 17565285A JP H0441931 B2 JPH0441931 B2 JP H0441931B2

Authority

JP

Japan

Prior art keywords

resistor

temperature

heat insulating

air flow

heat

Prior art date

1985-08-12

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired - Lifetime

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• 239000012528 membrane Substances 0.000 claims description 19
• 238000010438 heat treatment Methods 0.000 claims description 18
• 239000000758 substrate Substances 0.000 claims description 12
• 230000017525 heat dissipation Effects 0.000 claims description 2
• 230000000694 effects Effects 0.000 description 17
• 230000001419 dependent effect Effects 0.000 description 16
• 230000007423 decrease Effects 0.000 description 7
• 238000011144 upstream manufacturing Methods 0.000 description 7
• 238000002485 combustion reaction Methods 0.000 description 5
• 229910015365 Au—Si Inorganic materials 0.000 description 3
• 239000007767 bonding agent Substances 0.000 description 3
• 230000005496 eutectics Effects 0.000 description 3
• 230000020169 heat generation Effects 0.000 description 3
• 238000009413 insulation Methods 0.000 description 3
• 239000000463 material Substances 0.000 description 3
• 239000011347 resin Substances 0.000 description 3
• 229920005989 resin Polymers 0.000 description 3
• 230000004044 response Effects 0.000 description 3
• 229910000679 solder Inorganic materials 0.000 description 3
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
• 229910052782 aluminium Inorganic materials 0.000 description 2
• 239000010949 copper Substances 0.000 description 2
• 238000010586 diagram Methods 0.000 description 2
• KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 2
• 238000007772 electroless plating Methods 0.000 description 2
• 239000000446 fuel Substances 0.000 description 2
• 239000011521 glass Substances 0.000 description 2
• 238000002347 injection Methods 0.000 description 2
• 239000007924 injection Substances 0.000 description 2
• 238000004519 manufacturing process Methods 0.000 description 2
• 229910052863 mullite Inorganic materials 0.000 description 2
• 230000004043 responsiveness Effects 0.000 description 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 229910020220 Pb—Sn Inorganic materials 0.000 description 1
• 239000004642 Polyimide Substances 0.000 description 1
• XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
• 239000000853 adhesive Substances 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• 239000000919 ceramic Substances 0.000 description 1
• 239000004020 conductor Substances 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 230000007797 corrosion Effects 0.000 description 1
• 238000005260 corrosion Methods 0.000 description 1
• 238000001514 detection method Methods 0.000 description 1
• 238000007747 plating Methods 0.000 description 1
• 229920001721 polyimide Polymers 0.000 description 1
• 229910052710 silicon Inorganic materials 0.000 description 1
• 239000010703 silicon Substances 0.000 description 1