JPH04385B2 - - Google Patents
Info
- Publication number
- JPH04385B2 JPH04385B2 JP3182583A JP3182583A JPH04385B2 JP H04385 B2 JPH04385 B2 JP H04385B2 JP 3182583 A JP3182583 A JP 3182583A JP 3182583 A JP3182583 A JP 3182583A JP H04385 B2 JPH04385 B2 JP H04385B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- gate
- frame
- inner mold
- outer mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000000465 moulding Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3182583A JPS59158529A (ja) | 1983-03-01 | 1983-03-01 | 半導体装置の樹脂複数層封止方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3182583A JPS59158529A (ja) | 1983-03-01 | 1983-03-01 | 半導体装置の樹脂複数層封止方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59158529A JPS59158529A (ja) | 1984-09-08 |
| JPH04385B2 true JPH04385B2 (enrdf_load_stackoverflow) | 1992-01-07 |
Family
ID=12341852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3182583A Granted JPS59158529A (ja) | 1983-03-01 | 1983-03-01 | 半導体装置の樹脂複数層封止方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59158529A (enrdf_load_stackoverflow) |
-
1983
- 1983-03-01 JP JP3182583A patent/JPS59158529A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59158529A (ja) | 1984-09-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR0179920B1 (ko) | 칩 사이즈 패키지의 제조방법 | |
| JP2005159103A (ja) | 半導体装置およびその製造方法 | |
| JPH04385B2 (enrdf_load_stackoverflow) | ||
| JP2512441Y2 (ja) | 合成樹脂封止型半導体装置 | |
| JPS6232622A (ja) | 半導体装置用樹脂封止金型 | |
| JPS62156844A (ja) | リ−ドフレ−ム | |
| JP2535358B2 (ja) | 電子部品におけるモ―ルド部の製造方法 | |
| JP2009158978A (ja) | 半導体装置の製造方法 | |
| JPH03175658A (ja) | 樹脂封止型半導体装置及びその製造方法 | |
| JPS6223094Y2 (enrdf_load_stackoverflow) | ||
| KR0167276B1 (ko) | 비엘피 패키지 및 그 제조방법 | |
| JPS63164251A (ja) | リ−ドフレ−ム | |
| JP2014112714A (ja) | 半導体装置 | |
| JP2560194B2 (ja) | パッケージ型半導体装置の製造方法 | |
| JP2609830B2 (ja) | 樹脂封止型半導体装置用リードフレーム | |
| KR100253267B1 (ko) | 리드 온 칩(loc)패키지 제조방법 | |
| JP2714002B2 (ja) | 樹脂封止型半導体装置の製造方法 | |
| JP2997182B2 (ja) | 面実装用樹脂封止半導体装置 | |
| JPH029156A (ja) | 半導体装置の製造方法 | |
| JPS6217383B2 (enrdf_load_stackoverflow) | ||
| JPS6020546A (ja) | 半導体装置 | |
| JP2013042182A (ja) | 半導体装置の製造方法 | |
| JPH08124950A (ja) | 半導体装置の製造方法 | |
| JPS61170038A (ja) | 樹脂封止用金型 | |
| JPH0521647A (ja) | 樹脂封止型半導体装置およびその製造方法 |