JPH043802B2 - - Google Patents
Info
- Publication number
- JPH043802B2 JPH043802B2 JP60135928A JP13592885A JPH043802B2 JP H043802 B2 JPH043802 B2 JP H043802B2 JP 60135928 A JP60135928 A JP 60135928A JP 13592885 A JP13592885 A JP 13592885A JP H043802 B2 JPH043802 B2 JP H043802B2
- Authority
- JP
- Japan
- Prior art keywords
- image
- solder surface
- chip component
- chip
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 34
- 238000005286 illumination Methods 0.000 claims description 14
- 238000007689 inspection Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 6
- 238000006073 displacement reaction Methods 0.000 description 6
- 239000000835 fiber Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 238000009966 trimming Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60135928A JPS61294302A (ja) | 1985-06-24 | 1985-06-24 | チップ部品ずれ検査方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60135928A JPS61294302A (ja) | 1985-06-24 | 1985-06-24 | チップ部品ずれ検査方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61294302A JPS61294302A (ja) | 1986-12-25 |
| JPH043802B2 true JPH043802B2 (de) | 1992-01-24 |
Family
ID=15163125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60135928A Granted JPS61294302A (ja) | 1985-06-24 | 1985-06-24 | チップ部品ずれ検査方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61294302A (de) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0660810B2 (ja) * | 1987-10-29 | 1994-08-10 | 日本電装株式会社 | セラミック基板上半田画像処理装置 |
| JPH0237662A (ja) * | 1988-07-27 | 1990-02-07 | Toshiba Battery Co Ltd | 電池の絶縁性リング状薄板の位置ずれ検出方法 |
| US4929845A (en) * | 1989-02-27 | 1990-05-29 | At&T Bell Laboratories | Method and apparatus for inspection of substrates |
| JP2504853B2 (ja) * | 1990-03-14 | 1996-06-05 | 富士通株式会社 | ランド高さの欠陥検出装置 |
| JP2550514B2 (ja) * | 1992-05-11 | 1996-11-06 | 日本製紙株式会社 | 混入夾雑物の測定方法 |
| JP2818347B2 (ja) * | 1993-02-18 | 1998-10-30 | 株式会社三協精機製作所 | 外観検査装置 |
-
1985
- 1985-06-24 JP JP60135928A patent/JPS61294302A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61294302A (ja) | 1986-12-25 |
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