JPH043673B2 - - Google Patents
Info
- Publication number
- JPH043673B2 JPH043673B2 JP59265679A JP26567984A JPH043673B2 JP H043673 B2 JPH043673 B2 JP H043673B2 JP 59265679 A JP59265679 A JP 59265679A JP 26567984 A JP26567984 A JP 26567984A JP H043673 B2 JPH043673 B2 JP H043673B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed wiring
- wiring board
- circuit
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005520 cutting process Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Fluid-Pressure Circuits (AREA)
- Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)
- Vending Machines For Individual Products (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26567984A JPS61142787A (ja) | 1984-12-17 | 1984-12-17 | 電子回路装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26567984A JPS61142787A (ja) | 1984-12-17 | 1984-12-17 | 電子回路装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61142787A JPS61142787A (ja) | 1986-06-30 |
JPH043673B2 true JPH043673B2 (zh) | 1992-01-23 |
Family
ID=17420493
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26567984A Granted JPS61142787A (ja) | 1984-12-17 | 1984-12-17 | 電子回路装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61142787A (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4782947B2 (ja) * | 2001-06-15 | 2011-09-28 | 東芝モバイルディスプレイ株式会社 | 液晶パネル用プリント基板 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5412932A (en) * | 1977-06-28 | 1979-01-31 | Desoto Inc | Bat for baseball |
JPS5613788A (en) * | 1979-07-14 | 1981-02-10 | Omron Tateisi Electronics Co | Method of manufacturing printed circuit board |
-
1984
- 1984-12-17 JP JP26567984A patent/JPS61142787A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5412932A (en) * | 1977-06-28 | 1979-01-31 | Desoto Inc | Bat for baseball |
JPS5613788A (en) * | 1979-07-14 | 1981-02-10 | Omron Tateisi Electronics Co | Method of manufacturing printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
JPS61142787A (ja) | 1986-06-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5305523A (en) | Method of direct transferring of electrically conductive elements into a substrate | |
US5173055A (en) | Area array connector | |
JP2002094204A (ja) | 高周波モジュールとその製造方法 | |
KR100895964B1 (ko) | 저 프로파일 집적 모듈 상호접속들 | |
US5296082A (en) | Mold for printed wiring board | |
JPH043673B2 (zh) | ||
JPS59215786A (ja) | プリント配線板打抜用素材板 | |
JP3420147B2 (ja) | プリント配線母板の加工方法及びプリント配線母板 | |
US4761880A (en) | Method of obtaining surface mount component planarity | |
JP3635941B2 (ja) | 分割スルーホールプリント配線板用金型 | |
JP2749685B2 (ja) | 回路基板の製造方法 | |
JPH07112107B2 (ja) | プリント配線板及びその製造方法 | |
JP2666778B2 (ja) | 電子装置用基板編集体およびその分割方法 | |
JP3237212B2 (ja) | 段付き基板の製造方法 | |
JP3516331B2 (ja) | プリント配線板用割基板 | |
KR850000166B1 (ko) | 프린트 배선판의 제조방법 | |
JP2911286B2 (ja) | 回路基板の製造方法 | |
JPH04164383A (ja) | 金属プリント基板およびその製造方法 | |
JPH0427181Y2 (zh) | ||
JPS62257787A (ja) | モジユ−ルプリント板の多数個取り方法 | |
JPH0427179Y2 (zh) | ||
JPH07162104A (ja) | 回路基板及びその製造方法 | |
JPH09293949A (ja) | 樹脂製回路基板の製造方法 | |
JPH04132177A (ja) | 混成集積回路装置および混成集積回路装置における角柱部材への端子リードの装着方法 | |
JP3766149B2 (ja) | プリント配線板用長尺基材の外形加工方法及び外形加工金型 |