JPH0436114Y2 - - Google Patents
Info
- Publication number
- JPH0436114Y2 JPH0436114Y2 JP1986131950U JP13195086U JPH0436114Y2 JP H0436114 Y2 JPH0436114 Y2 JP H0436114Y2 JP 1986131950 U JP1986131950 U JP 1986131950U JP 13195086 U JP13195086 U JP 13195086U JP H0436114 Y2 JPH0436114 Y2 JP H0436114Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- chip
- wiring
- bump
- connection wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 239000000758 substrate Substances 0.000 description 7
- 230000008646 thermal stress Effects 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/023—Redistribution layers [RDL] for bonding areas
- H01L2224/0235—Shape of the redistribution layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986131950U JPH0436114Y2 (sv) | 1986-08-28 | 1986-08-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986131950U JPH0436114Y2 (sv) | 1986-08-28 | 1986-08-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6338328U JPS6338328U (sv) | 1988-03-11 |
| JPH0436114Y2 true JPH0436114Y2 (sv) | 1992-08-26 |
Family
ID=31030878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986131950U Expired JPH0436114Y2 (sv) | 1986-08-28 | 1986-08-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0436114Y2 (sv) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0834210B2 (ja) * | 1988-04-28 | 1996-03-29 | 富士電機株式会社 | 半導体素子の突起電極 |
| KR20140041975A (ko) * | 2012-09-25 | 2014-04-07 | 삼성전자주식회사 | 범프 구조체 및 이를 포함하는 전기적 연결 구조체 |
| JP2015228472A (ja) * | 2014-06-03 | 2015-12-17 | 株式会社ソシオネクスト | 半導体装置およびその製造方法 |
-
1986
- 1986-08-28 JP JP1986131950U patent/JPH0436114Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6338328U (sv) | 1988-03-11 |
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